Semiconductor device

Patent metadata

Field	Value
Publication number	US-9443779-B2
Application number	US-201514848171-A
Country	US
Kind code	B2
Filing date	Sep 8, 2015
Priority date	Sep 13, 2013
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a molded body that is obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to the other surface of the semiconductor element,
wherein the sealing material includes:
a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and
a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof,
wherein the first sealing material forms a first sealing layer that covers the semiconductor element and is provided in a region adjacent to the semiconductor element, and the second sealing material forms a second sealing layer that covers the first sealing layer and optionally forms an outer surface of the molded body.

2. The semiconductor device according to claim 1 , wherein the semiconductor element has a maximum operating temperature, and wherein the first sealing layer seals at least a region that is 25° C. lower than the maximum operating temperature of the semiconductor element when the semiconductor element operates.

3. A semiconductor device, comprising:
a molded body that is obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to the other surface of the semiconductor element,
wherein the sealing material includes:
a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and
a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof,
wherein the second sealing material forms a first sealing layer that covers the semiconductor element, the insulating substrate, and the printed circuit board, and
wherein the first sealing material forms a second sealing layer that covers the first sealing layer, faces at least a portion of an outer surface of the molded body, and is provided with a thickness of at least 300 μm.

4. The semiconductor device according to claim 3 , wherein the second sealing layer has a thickness of 3 mm or less.

5. A semiconductor device, comprising:
a molded body that is obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to the other surface of the semiconductor element,
wherein the sealing material includes:
a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and
a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof,

wherein the first sealing material forms a first sealing layer that covers the semiconductor element and is provided in a region adjacent to the semiconductor element, wherein the second sealing material forms a second sealing layer that covers the first sealing material, and-wherein the first sealing material forms a third sealing layer that further covers the second sealing layer, faces at least a portion of an outer surface of the molded body, and is provided with a thickness of at least 300 μm.

6. The semiconductor device according to claim 5 , wherein the semiconductor element has a maximum operating temperature, wherein the first sealing layer seals at least a region that is 25° C. lower than a maximum operating temperature of the semiconductor element when the semiconductor element operates, and wherein the third sealing layer has a thickness of 3 mm or less.

7. The semiconductor device according to claim 1 , wherein the inorganic filler includes at least one of molten silica and crushed silica.

8. The semiconductor device according to claim 1 , wherein the nanocomposite resin includes 0.1 mass % to 25 mass % of the inorganic filler.

9. The semiconductor device according to claim 1 , wherein the semiconductor element is a SiC semiconductor element.

10. A semiconductor device, comprising:
a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element; and
a sealing member provided around the member to seal the member and provide a molded body, the sealing member including a plurality of layers comprised of respective sealing material including:
a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler having an average particle size ranging from 1 nm to 100 nm; and
a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof,
wherein the plurality of layers includes:
a first sealing layer formed of the first sealing material that covers the semiconductor element and is provided in a region adjacent to the semiconductor element; and
a second sealing layer formed of the second sealing material that covers the first sealing layer and optionally forms an outer surface of the molded body.

11. The semiconductor device according to claim 10 , wherein the semiconductor element has a maximum operating temperature, and wherein the first sealing layer seals at least a region that has an operating temperature that is 25° C. lower than the maximum operating temperature of the semiconductor element when the semiconductor element operates.

12. A semiconductor device, comprising:
a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element; and
a sealing member provided around the member to seal the member and provide a molded body, the sealing member including a plurality of layers comprised of respective sealing material including:
a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler having an average particle size ranging from 1 nm to 100 nm; and

a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof,
wherein the plurality of layers includes:
a first sealing layer formed of the second sealing material that covers the semiconductor element, the insulating substrate, and the printed circuit board; and
a second sealing layer formed of the first sealing material that covers the first sealing layer, that faces at least a portion of an outer surface of the molded body, and that has a thickness of at least 300 μm.

13. The semiconductor device according to claim 12 , wherein the second sealing layer has a thickness of 3 mm or less.

14. A semiconductor device, comprising:
a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external c

Assignees

• Fuji Electric Co Ltd

Inventors

• Takematsu Yuji
• Yanagawa Katsuhiko
• Okamoto Kenji

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title