RFID tag and fuse

Patent metadata

Field	Value
Publication number	US-9443187-B2
Application number	US-201414228428-A
Country	US
Kind code	B2
Filing date	Mar 28, 2014
Priority date	Oct 5, 2011
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

An RFID tag includes an antenna, a first IC chip connected to the antenna, and a first fuse inserted between the antenna and the first IC chip, or inserted in series with the antenna. In the RFID tag, the first fuse becomes electrically conductive at a first temperature or above, and remains in an electrical conductive state after having become electrically conductive.

First claim

What is claimed is:

1. An RFID tag, comprising:
an antenna;
a first IC chip connected to the antenna; and
a first fuse inserted between the antenna and the first IC chip, or inserted in series with the antenna, wherein the first fuse becomes electrically conductive at a first temperature or above, and remains in an electrical conductive state after having become electrically conductive,
wherein the first fuse includes
a pair of first contact points, and
a first solder disposed close to the first contact points in a state where the first solder has not melted, the first solder being configured to melt at the first temperature,
wherein the first solder causes an interval between the first contact points to be electrically conductive at the first temperature or above, and remains in an electrical conductive state of the interval between the first contact points after the interval between the first contact points has become electrically conductive.

2. The RFID tag as claimed in claim 1 , wherein
the first fuse becomes electrically conductive when the first solder has melted at the first temperature.

3. The RFID tag as claimed in claim 1 , wherein the first fuse further includes
a first solvent disposed between the first contact points and the first solder in a state where the first solder has not melted.

4. The RFID tag as claimed in claim 1 , wherein the first fuse further includes
first spare solder that is disposed, after the first solder has melted, on surfaces of the first contact points to which the first solder is connected.

5. The RFID tag as claimed in claim 1 , further comprising:
a second IC chip; and
a second fuse, wherein
the antenna includes a first antenna part and a second antenna part that are connected in parallel with each other,
the first IC chip is connected to the first antenna part, and
the first fuse is inserted between the first antenna part and the first IC chip, or is inserted in series with the first antenna part, and wherein
the second IC chip is connected to the second antenna part,
the second fuse is inserted between the second antenna part and the second IC chip, or is inserted in series with the second antenna part, and
the second fuse becomes electrically non-conductive at a second temperature or above, and remains in an electrical non-conductive state after having become electrically non-conductive.

6. The RFID tag as claimed in claim 5 , wherein the second fuse includes
a pair of second contact points, and
second solder connecting the second contact points in a state where the second solder has not melted, the second solder being configured to melt at the second temperature, wherein when the second solder has melted at the second temperature to disconnect the second contact points, an interval between the pair of the second contact points becomes electrically non-conductive.

7. The RFID tag as claimed in claim 6 , wherein the second fuse further includes
a second solvent disposed close to the second solder in a state where the second solder has not melted.

8. The RFID tag as claimed in claim 6 , wherein the second fuse further includes
a soldering bump that is brought into contact with a central part of the second solder between the second contact points in a state where the second solder has not melted.

9. The RFID tag as claimed in claim 6 , wherein the second fuse further includes
second spare solder disposed close to the second solvent in a state where the second solder has not melted.

10. The RFID tag as claimed in claim 5 , wherein
the second temperature is equal to or less than the first temperature.

Assignees

• Fujitsu Ltd

Inventors

• Ozaki Noritsugu

Classifications

• G06K19/0715

  the arrangement including means to regulate power transfer to the integrated circuit · CPC title

• G06K19/0717

  the sensor being capable of sensing environmental conditions such as temperature history or pressure · CPC title

• G06K19/07345

  by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches · CPC title

• G06K19/07771 Primary

  the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object · CPC title

• G01K11/06

  using melting, freezing, or softening · CPC title