Branched shape optical isolator and optical apparatus, method and applications

Patent metadata

Field	Value
Publication number	US-9442247-B2
Application number	US-201213663675-A
Country	US
Kind code	B2
Filing date	Oct 30, 2012
Priority date	Nov 2, 2011
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

A branched optical isolator includes, located over a substrate, at least two branches connected to a trunk at a junction location. At least one branch comprises an optical absorber material and at least one branch comprises an optical transmitter material. The optical isolator may be incorporated into an optical chip carrier such that: (1) an optical emitting portion of an optical chip integral to or attached to the optical chip carrier; and (2) a connection to the optical isolator, are butt connected with a gap less than 10 nanometers, and otherwise materials matched. The optical isolator provides for attenuated backscattered optical radiation into the optical chip.

First claim

What is claimed is:

1. An optical component comprising:
a substrate; and
an optical isolator comprising a branched shape located over the substrate, the branched shape including at least two branches connected to a trunk at a junction location, where:
at least one of the at least two branches comprises an optical absorber material and is contiguous with the trunk; and
at least one of the at least two branches comprises an optical transmitter material and is separated from the trunk by a gap.

2. The optical component of claim 1 wherein the substrate comprises a silicon substrate.

3. The optical component of claim 1 wherein:
the optical absorber material comprises a doped silicon material; and
the optical transmitter material comprises a monocrystalline silicon material.

4. The optical component of claim 1 wherein each of the at least two branches has:
a width from about 1 to about 20 microns; and
a thickness from about 0.5 to about 5 microns.

5. The optical component of claim 1 wherein the gap has a width from about 0.0001 to about 1 microns.

6. An optical component comprising:
a substrate; and
a branched shape optical isolator comprising at least two branches connected to a trunk at a junction location and located over the substrate, wherein:
at least one branch within the at least two branches comprises an optical absorber material;
at least one branch within the at least two branches comprises an optical transmitter material and terminates over the substrate at an assembly location for an optical chip with respect to the substrate, the assembly location including at least one registration guide, wherein:
the branched shape optical isolator and the registration guide comprise the same material; and
the branched shape optical isolator and the registration guide rise above the substrate surface by the same amount.

7. The optical component of claim 6 wherein the branch that terminates at the assembly location for the optical chip terminates in a vertical face at the assembly location for the optical chip.

8. The optical component of claim 6 wherein the assembly location for the optical chip includes at least one registration guide for the optical chip rising above the substrate.

9. An optical component comprising:
a substrate; and
a branched shape optical isolator comprising at least two branches connected to a trunk at a junction location and located over the substrate, wherein:
at least one branch within the at least two branches comprises an optical absorber material;
at least one branch within the at least two branches comprises an optical transmitter material and terminates over the substrate at an assembly location for an optical chip with respect to the substrate, the assembly location including at least one registration guide wherein the assembly location for the optical chip includes at least one registration guide for the optical chip penetrating into the substrate, wherein the at least one registration guide is a linewidth tapered rectangular recess.

10. The optical component of claim 9 wherein the linewidth tapered rectangular recess includes a heat sink structure.

11. An optical component comprising:
a substrate;
a branched shape optical isolator including at least two branches connected to a trunk at a junction location and located over the substrate, wherein:
at least one of the at least two branches comprises an optical absorber material;
at least one of the at least two branches comprises an optical transmitter material and terminates over the substrate with a vertical face at an assembly location for an optical chip, the assembly location including at least one registration guide; and the optical chip assembled at the assembly location over the substrate, wherein
the branched shape optical isolator and the registration guide comprise the same material; and
the branched shape optical isolator and the registration guide rise above the substrate surface by the same amount.

12. The optical component of claim 11 wherein an optical output location of the optical chip is vertically aligned with the vertical face of the branch that terminates at the assembly location.

13. The optical component of claim 12 wherein the vertically aligned optical output location of the optical chip and vertical face of the branch that terminates at the assembly location are separated by no greater than about 10 nanometers.

14. The optical component of claim 13 wherein a portion of the optical chip and a portion of the branch that terminates at the assembly location together comprise a laser.

15. An optical component comprising:
a substrate; and
a branched shape optical isolator comprising at least two branches connected to a trunk at a junction location and located over the substrate, wherein:
at least one branch within the at least two branches comprises an optical absorber material and is contiguous with the trunk;
at least one branch within the at least two branches comprises an optical transmitter material that is separated from the trunk by a gap and terminates over the substrate at an assembly location for an optical chip with respect to the substrate.

16. An optical component comprising:
a substrate; and
a branched shape optical isolator comprising at least two branches connected to a trunk at a junction location and located over the substrate, wherein:
at least one branch within the at least two branches comprises an optical absorber material and is contiguous with the trunk;
at least one branch within the at least two branches comprises an optical transmitter material that is separated from the trunk by a gap and terminates over the substrate at an assembly location for an optical chip with respect to the substrate; and

an optical chip located at the assembly location for the optical chip.

Assignees

• Univ Central Florida Res Found Inc
• Univ Central Florida Res Found Inc

Inventors

• Deppe Dennis

Classifications

• B82Y20/00

  Nanooptics, e.g. quantum optics or photonic crystals · CPC title

• H01S5/3412

  quantum box or quantum dash · CPC title

• G02B2006/12121

  Laser · CPC title

• H01S5/141

  using a wavelength selective device, e.g. a grating or etalon (H01S5/146 takes precedence) · CPC title

• G02B6/12004 Primary

  Combinations of two or more optical elements · CPC title