Magnetic sensing device with reduced shield-to-shield spacing

US9442171B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9442171-B2
Application numberUS-97166408-A
CountryUS
Kind codeB2
Filing dateJan 9, 2008
Priority dateJan 9, 2008
Publication dateSep 13, 2016
Grant dateSep 13, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A magnetic sensor assembly includes first and second shields each comprised of a magnetic material. The first and second shields define a physical shield-to-shield spacing. A sensor stack is disposed between the first and second shields and includes a seed layer adjacent the first shield, a cap layer adjacent the second shield, and a magnetic sensor between the seed layer and the cap layer. At least a portion of the seed layer and/or the cap layer comprises a magnetic material to provide an effective shield-to-shield spacing of the magnetic sensor assembly that is less than the physical shield-to-shield spacing.

First claim

Opening claim text (preview).

The invention claimed is: 1. A magnetic sensor assembly comprising: first and second shields comprising a magnetic material, wherein a distance between the first and second shields defines a physical shield-to-shield spacing; and a sensor stack positioned between the first and second shields, the sensor stack including a first seed layer, first cap layer, and magnetic sensor; wherein the first seed layer and first cap layer comprise a magnetic material such that an effective shield-to-shield spacing of the magnetic sensor assembly does not include the first seed layer and first cap layer. 2. The magnetic sensor assembly of claim 1 , wherein the first seed layer comprises a material selected from the group consisting of NiFeNb, NiFeTa, NiFeRh, CoZrTa, CoZrNb, CoZrNd, CoFeB, CoFeTa, CoFeZr, CoFeRh, CoFe, CoCr, or Ni >70% Cr <30% . 3. The magnetic sensor assembly of claim 1 , wherein a crystalline structure of the first seed layer matches a crystalline structure of the first shield. 4. The magnetic sensor assembly of claim 1 , wherein a crystalline structure of the first cap layer matches a crystalline structure of the second shield. 5. The magnetic sensor assembly of claim 1 , wherein the first seed layer comprises an amorphous material. 6. The magnetic sensor assembly of claim 1 , wherein the first seed layer has a thickness between about 10 Å and 1,000 Å. 7. The magnetic sensor assembly of claim 6 , wherein the first seed layer is 50 Å thick. 8. The magnetic sensor assembly of claim 1 , further comprising: a nonmagnetic second seed layer adjacent the first seed layer. 9. The magnetic sensor assembly of claim 8 , wherein the second seed layer comprises either Ru or Cu. 10. The magnetic sensor assembly of claim 9 , wherein the first seed layer comprises CoZrTa. 11. The magnetic sensor assembly of claim 10 , wherein the first seed layer is 30 Å thick and the second seed layer is 30 Å thick. 12. The magnetic sensor assembly of claim 1 , further comprising: a nonmagnetic second cap layer adjacent the first cap layer. 13. The magnetic sensor assembly of claim 12 , wherein the second cap layer comprises Ta. 14. The magnetic sensor assembly of claim 13 , wherein the first cap layer comprises a material selected from the group consisting of NiFeNb, NiFeTa, NiFeRh, CoZrTa, CoZrNb, CoZrNd, CoFeB, CoFeTa, CoFeZr, CoFeRh, CoFe, CoCr, or Ni >70% Cr <30% . 15. A magnetic sensor assembly comprising: first and second shields comprising a magnetic material, wherein a distance between the first and second shields defines a physical shield-to-shield spacing; and a sensor stack positioned between the first and second shields, the sensor stack including a first seed layer comprising an amorphous material, first cap layer, and magnetic sensor; wherein the first seed layer and first cap layer comprise a magnetic material such that an effective shield-to-shield spacing of the magnetic sensor assembly does not include the first seed layer and first cap layer. 16. A magnetic sensor assembly comprising: first and second shields comprising a magnetic material, wherein a distance between the first and second shields defines a physical shield-to-shield spacing; and a sensor stack positioned between the first and second shields, the sensor stack including a first seed layer, first cap layer, and magnetic sensor; wherein the first seed layer and first cap layer comprise a magnetic material such that an effective shield-to-shield spacing of the magnetic sensor assembly does not include the first seed layer and first cap layer, and wherein a crystalline structure of the first cap layer matches a crystalline structure of the second shield.

Assignees

Inventors

Classifications

  • G01R33/093Primary

    using multilayer structures, e.g. giant magnetoresistance sensors (thin magnetic films H01F10/00) · CPC title

  • G11B5/3912Primary

    Arrangements in which the active read-out elements are transducing in association with active magnetic shields, e.g. magnetically coupled shields (G11B5/3916 takes precedence) · CPC title

  • Specially shaped layers · CPC title

  • Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance · CPC title

  • Protection, e.g. with housings against stray fields · CPC title

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What does patent US9442171B2 cover?
A magnetic sensor assembly includes first and second shields each comprised of a magnetic material. The first and second shields define a physical shield-to-shield spacing. A sensor stack is disposed between the first and second shields and includes a seed layer adjacent the first shield, a cap layer adjacent the second shield, and a magnetic sensor between the seed layer and the cap layer. At …
Who is the assignee on this patent?
Singleton Eric W, He Qing, Yi Jae-Young, and 5 more
What technology area does this patent fall under?
Primary CPC classification G01R33/093. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 13 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).