Infrared imaging probe

Patent metadata

Field	Value
Publication number	US-9442019-B2
Application number	US-64717509-A
Country	US
Kind code	B2
Filing date	Dec 24, 2009
Priority date	Dec 26, 2008
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

An infrared imaging probe that includes an elongated wand and an electrically isolating connection between the imaging components, located at the distal end of the wand, and the image processing components, located at the proximal end of the wand.

First claim

What is claimed is:

1. An infrared imaging system comprising:
an infrared imaging probe, including:
an elongate wand having a proximal end and a distal end, the distal end being electrically isolated from the proximal end,
a front-end assembly coupled to the distal end of the wand and comprising a lens, a focal plane array, and distal circuitry, the lens being configured to receive image information in the form of infrared energy and direct the infrared energy onto the focal plane array, the distal circuitry being adapted to process signals from the focal plane array and produce an output signal,
a handle coupled to the proximal end of the wand, and
processing circuitry connected to and electrically isolated from the distal circuitry, the processing circuitry being coupled to the proximal end of the wand and providing an electrically conductive output connection, the processing circuitry being adapted to receive and process the output signal, the electrical isolation of the wand distal and proximal ends combined with the electrical isolation of the distal circuitry and processing circuitry eliminating all conductive paths between the proximal end and the distal end of the wand, whereby a user can grip the infrared imaging probe at the proximal end of the wand with reduced risk of electrical shock from the distal end of the wand;

an output or control device separate from and not physically supported by the wand; and
a conductor extending between and electrically connectable to the output connection and the output or control device, the processing circuitry being adapted to process the output signal for electrical transmission to the output or control device via the output connection and the conductor.

2. The infrared imaging system of claim 1 , wherein the distal circuitry comprises one or more of a bias generator, a pre-amplifier, and an integrator.

3. The infrared imaging system of claim 2 , wherein the distal circuitry further comprises an A/D converter.

4. The infrared imaging system of claim 1 , wherein the front-end assembly further comprises one or more sensors.

5. The infrared imaging system of claim 4 , wherein the one or more sensors is a temperature sensor.

6. The infrared imaging system of claim 1 , wherein the wand comprises a non-conductive material.

7. The infrared imaging system of claim 6 , wherein the non-conductive material is carbon fiber.

8. The infrared imaging system of claim 1 , wherein the distal circuitry and processing circuitry are connected and electrically isolated by an optical connection.

9. The infrared imaging system of claim 1 , wherein the distal circuitry and processing circuitry are connected and electrically isolated by a wireless connection.

10. The infrared imaging system of claim 1 , wherein the processing circuitry comprises a field-programmable gate array/complex programmable logic device controller.

11. The infrared imaging system of claim 1 , wherein the output connection comprises a USB connection.

12. The infrared imaging system of claim 1 , wherein the output or control device comprises one or more of a digital multimeter, a personal computer, a personal digital assistant, a display device, and a cellular phone.

13. The infrared imaging system of claim 1 , wherein the focal plane array comprises a microbolometer array.

14. The infrared imaging system of claim 13 , wherein the microbolometer array includes a 50 by 50 grid of microbolometers.

15. The infrared imaging system of claim 1 , wherein the lens comprises one or more of a standard field of view lens, a narrow field of view lens, and a wide-angle lens.

16. The infrared imaging system of claim 1 , wherein the front-end assembly further comprises a visible light camera.

17. An infrared imaging system comprising:
an infrared imaging probe, including:
a wand having a proximal end and a distal end, the distal end being electrically isolated from the proximal end, and the wand including a handle coupled to the proximal end of the wand, a front-end assembly coupled to the distal end, the front-end assembly configured to receive image information in the form of infrared energy and condition the image information to produce an unprocessed output signal,
processing circuitry connected to and electrically isolated from the front-end assembly and configured to receive and process the unprocessed output signal from the front-end assembly, the processing circuitry being proximate the proximal end of the wand,
an electrically conductive output connection proximate the proximal end of the wand and coupled to the processing circuitry, and
an electrically isolating connector connecting the front-end assembly to the processing circuitry and configured to facilitate the communication of the unprocessed output signal from the front-end assembly to the processing circuitry, the electrical isolation of the wand distal and proximal ends combined with the electrical isolation of the electrically isolating connector eliminating all conductive paths between the proximal end and the distal end of the wand, whereby a user can grip the proximal end of the wand with reduced risk of electrical shock from the distal end of the wand; and

an output or control device separate from and not physically supported by the wand; and
a conductor extending between and electrically connectable to the output connection and the output or control device, the processing circuitry being adapted to process the output signal for electrical transmission to the output or control device via the output connection and the conductor.

18. The infrared imaging system of claim 17 , wherein the processing circuitry is adapted to process the output signal for output to the output or control device.

19. An infrared imaging system comprising:
an infrared imaging probe, including:
an elongate wand having a proximal end and a distal end, the distal end being electrically isolated from the proximal end,
an image collecting assembly coupled to the distal end of the wand, the assembly configured to receive image information in the form of infrared energy and process the image information to produce an output signal,
a handle coupled to the proximal end of the wand,
processing circuitry connected to and electrically isolated from the image collecting assembly, the processing circuitry being located at the proximal end of the wand and providing an electrically conductive output connection, and
wherein the electrical isolation of the wand distal and proximal ends combined with the electrical isolation of the processing circuitry eliminates all conductive paths between the proximal end and the distal end of the wand, whereby a user can grip the infrared imaging probe at the proximal end of the wand with reduced risk of electrical shock from the distal end of the wand; and

an output or control device separate from and not physically supported by the wand; and
a conductor extending between and electrically connectable to the output connection and the output or control device, the processing circuitry being adapted to process the output signal for electrical transmission to the output or control devices via the output connection and the conductor.

20. The infrared imaging system of claim 19 , wherein the image collecting assembly comprises a lens, and a focal plane array having an integrated digital output.

Assignees

• Schmidt Matthew F
• Mcmanus Thomas J
• Fluke Corp

Inventors

• Schmidt Matthew F
• Mcmanus Thomas J

Classifications

• G01J5/08

  Optical arrangements · CPC title

• G01J5/02

  Constructional details · CPC title

• H10F39/184

  Infrared image sensors · CPC title

• G01J5/0066

  for hot spots detection · CPC title

• G01J2005/0081

  Physics · mapped topic