Light-emitting structure

Patent metadata

Field	Value
Publication number	US-9441817-B2
Application number	US-201414474449-A
Country	US
Kind code	B2
Filing date	Sep 2, 2014
Priority date	Oct 30, 2013
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

A light-emitting structure comprises a carrier, a light-emitting diode package, and a fixing module. The light-emitting diode package comprises a brittle substrate and a light-emitting unit. The brittle substrate is disposed on the carrier and the light-emitting unit is disposed on the brittle substrate. The fixing module comprises at least two screw units and at least two elastic members which sleeve the screw unit respectively. Each of screw units is screwed onto the carrier and applies a force on the upper surface of the brittle substrate, so as to fasten the brittle substrates to the carrier. Each of elastic members is disposed between the respective screw unit and the carrier, so as to adjust the force from the screw unit.

First claim

What is claimed is:

1. A light-emitting structure comprising:
a carrier;
a light-emitting diode package including a brittle substrate disposed on the carrier and a light-emitting unit disposed on the brittle substrate; and
a fixing module including at least two screw units and at least two elastic members respectively sleeved on the screw units, wherein the screw units are screwed to the carrier and each of the screw units applies a force on the carrier and the brittle substrate for fastening the brittle substrate to the carrier, each of the elastic members is disposed between the respective screw unit and the carrier for adjusting the force applied on the brittle substrate by the at least two screw units;
wherein a spring constant of the elastic member satisfies the following formula

K
<

2
⁢

⁢

bd
2

⁢
σ

3
⁢

⁢

L
⁡

(

X
-
Y

)

wherein K is the spring constant of the elastic member, b is a width of the brittle substrate, d is a thickness of the brittle substrate, and σ is a flexural strength of the brittle substrate, L is a distance between the at least two screw units, X is an original length of the elastic member, and Y is a length of the deformed elastic member compressed between the screw unit and the carrier.

2. The light-emitting structure according to claim 1 , wherein the light-emitting unit includes at least one light-emitting diode disposed on the brittle substrate, an annular frame disposed on the brittle substrate and encircling the light-emitting diode, and an encapsulation body accommodated within the annular frame and covering the light-emitting diode.

3. The light-emitting structure according to claim 1 , wherein the light-emitting unit has at least two solder pads, the light-emitting diode package includes a protecting layer disposed on the brittle substrate, and the protecting layer has a first opening for exposing a chip-mounting area that at least one light-emitting diode is mounted thereon and at least two second openings for exposing the at least two solder pads.

4. The light-emitting structure according to claim 3 , wherein the protecting layer partially covers edges of the at least two solder pads.

5. The light-emitting structure according to claim 4 , wherein the protecting layer is a thin film made of glass gel.

6. The light-emitting structure according to claim 1 , wherein the two screw units of the fixing module are disposed on two opposite corners of the brittle substrate or are disposed on two sides of the brittle substrate.

7. The light-emitting structure according to claim 1 , wherein the fixing module further comprises at least two washers respectively sleeved around the two screw units, each of the two screw units presses downward on an upper surface of the brittle substrate through the respective washer for applying the force on the brittle substrate.

8. The light-emitting structure according to claim 7 , wherein the two washers are selected from the groups consisting of a harder material and a soft material.

9. The light-emitting structure according to claim 7 , wherein each of the two washers has a shape selected from the groups consisting of circular and rectangular.

10. The light-emitting structure according to claim 7 , wherein each of the two washers is a circular disc, the circular disc includes a groove thereunder, the groove substantially occupies a quarter circle of the circular disc and half thickness of the circular disc.

11. The light-emitting structure according to claim 1 , wherein the light-emitting structure further comprises two buffer units disposed on an upper surface of the brittle substrate, the at least two screw units respectively press downward on the upper surface of the brittle substrate through the at least two buffer units for applying the force on the brittle substrate.

12. The light-emitting structure according to claim 11 , wherein the two buffer units are disposed on two opposite corners of the brittle substrate and are respectively proximal to the screw units, and solder pads are disposed on the other two opposite corners of the brittle substrate.

13. The light-emitting structure according to claim 12 , wherein the fixing module further comprises at least two washers respectively sleeved on the two screw units, and each of the screw units presses downward on the upper surface of the brittle substrate through the respective washer and the respective buffer unit for applying a force on the brittle substrate.

14. The light-emitting structure according to claim 1 , wherein the brittle substrate is a ceramic substrate having a plurality of micropores, and a thermal conductive material at least fills in a portion of the plurality of micropores.

15. The light-emitting structure according to claim 14 , wherein the thermal conductive material is embedded at an underside of the brittle substrate, the brittle substrate is disposed on the carrier through a thermal pad, and the brittle substrate having the thermal conductive material thereunder is attached to the thermal pad.

16. The light-emitting structure according to claim 15 , wherein an area occupied by the thermal conductive material is smaller than an area occupied by the brittle substrate, and the area occupied by the thermal conductive material is greater than an area occupied by the light-emitting unit.

17. The light-emitting structure according to claim 1 , wherein the length of the deformed elastic member satisfies the following formula: d+h<Y<a+d+h, wherein a is a thickness of the buffer unit, h is a thickness of the thermal pad, and d is the thickness of the brittle substrate.

18. The light-emitting structure according to claim 1 , wherein an included angle between the fixing module and the brittle substrate is twenty to thirty five degrees.

19. The light-emitting structure according to claim 1 , wherein each of the at least two screw units includes a head portion and a thread portion, at least two screw holes are arranged on the carrier, the thread portion of each of the screw units is fastened into the respective screw hole of the carrier, and an underside of the head portion of the screw unit abuts an upper surface of the brittle substrate so as to directly apply the force on the upper surface of the brittle substrate.

Assignees

• Lite On Electronics Guangzhou Ltd
• Lite On Technology Corp

Inventors

• Chiu Kuo-Ming
• Chou Meng-Sung
• Lin Chen-Hsiu

Classifications

• F21V19/0055 Primary

  by screwing · CPC title

• F21Y2105/10

  comprising a two-dimensional [2D] array of point-like light-generating elements · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21Y2105/001

  Mechanical Engineering · mapped topic

• F21Y2101/02

  Mechanical Engineering · mapped topic