Composition for encapsulant, encapsulant, and electronic element

Patent metadata

Field	Value
Publication number	US-9441111-B2
Application number	US-201314653605-A
Country	US
Kind code	B2
Filing date	Nov 29, 2013
Priority date	Dec 26, 2012
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si—Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si—H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.

First claim

The invention claimed is:

1. A composition for an encapsulant, the composition comprising
a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si—Vi) at a terminal end thereof, and
a second polysiloxane including hydrogen bound to silicon (Si—H) at a terminal end thereof:

wherein, in Chemical Formula 1,
A is a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heteroarylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof, and
R 1 to R 4 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group, or a combination thereof.

2. The composition for an encapsulant of claim 1 , wherein A is a substituted or unsubstituted C6 to C20 arylene group.

3. The composition for an encapsulant of claim 1 , wherein the second polysiloxane is represented by Chemical Formula 2:
(R 5 R 6 R 7 SiO 1/2 ) M1 (R 8 R 9 SiO 2/2 ) D1 (R 10 SiO 3/2 ) T1 (SiO 3/2 —Y 1 —SiO 3/2 ) T2 (SiO 4/2 ) Q1   [Chemical Formula 2]

wherein, in Chemical Formula 2,
R 5 to R 10 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group, or a combination thereof,
at least one of R 5 to R 10 is hydrogen,
Y 1 is a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heteroarylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof,
0<M1<1, 0<D1<1, 0<T1<1, 0<T2<1, 0<Q1<1, and
M1+D1+T1+T2+Q1=1.

4. The composition for an encapsulant of claim 1 , wherein:
the first polysiloxane is included in an amount of 10 to 80 wt %, based on a total weight of the composition for an encapsulant, and
the second polysiloxane is included in an amount of 20 to 90 wt %, based on the total weight of the composition for an encapsulant.

5. The composition for an encapsulant of claim 1 , further comprising a third polysiloxane represented by Chemical Formula 3:
(R 11 R 12 R 13 SiO 1/2 ) M2 (R 14 R 15 SiO 2/2 ) D2 (R 16 SiO 3/2 ) T3 (SiO 3/2 —Y 2 —SiO 3/2 ) T4 (SiO 4/2 ) Q2   [Chemical Formula 3]

wherein, in Chemical Formula 3,
R 11 to R 16 are each independently substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group, or a combination thereof,
at least one of R 11 to R 16 is a substituted or unsubstituted C2 to C30 alkenyl group,
Y 2 is a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heteroarylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof,
0<M2<1, 0<D2<1, 0<T3<1, 0<T4<1, 0<Q2<1, and M2+D2+T3+T4+Q2=1.

6. The composition for an encapsulant of claim 5 , wherein at least one of T3 and T4 of Chemical Formula 3 is not 0.

7. The composition for an encapsulant of claim 5 , wherein:
the first polysiloxane is included in an amount of 10 to 50 wt %, based on a total weight of the composition for an encapsulant,
the second polysiloxane is included in an amount of 20 to 60 wt %, based on the total weight of the composition for an encapsulant, and
the third polysiloxane is included in an amount of 30 to 70 wt %, based on the total weight of the composition for an encapsulant.

8. An encapsulant obtained by curing the composition for an encapsulant of claim 1 .

9. An electronic element comprising the encapsulant of claim 8 .

Assignees

• Cheil Ind Inc
• Cheil Ind Inc

Inventors

• Koh Sang-Ran
• Kim Woo-Han
• Woo Chang-Soo
• Kim Ha-Neul
• An Chi-Won
• Lee Eun-Seon

Classifications

• H10W74/476

  Organic materials comprising silicon · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H10H20/853

  characterised by their shape · CPC title

• C08L83/04 Primary

  Polysiloxanes · CPC title