Anti-biofouling coating based on epoxy resin and amine-functional polysiloxane
US-2018355189-A1 · Dec 13, 2018 · US
Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material
US9441069B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9441069-B2 |
| Application number | US-201314389068-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 19, 2013 |
| Priority date | Mar 27, 2012 |
| Publication date | Sep 13, 2016 |
| Grant date | Sep 13, 2016 |
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Abstract
Official abstract text for this publication.
The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.
First claim
Opening claim text (preview).
The invention claimed is: 1. An epoxy resin represented by general formula (I) below, wherein, Q each independently represent a linear alkylene chain having 1 to 9 carbon atoms, a branched alkylene chain having a structure in which an alkyl group having 1 to 18 carbon atoms is bonded to a carbon atom of the linear alkylene chain, or a linkage chain having an ether bond present…
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Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9441069B2 cover?
- The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below…
- Who is the assignee on this patent?
- Dainippon Ink & Chemicals
- What technology area does this patent fall under?
- Primary CPC classification C08G59/1494. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Sep 13 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).