Multi-part fluid flow structure

US9440441B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9440441-B2
Application numberUS-201214648071-A
CountryUS
Kind codeB2
Filing dateDec 3, 2012
Priority dateDec 3, 2012
Publication dateSep 13, 2016
Grant dateSep 13, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In one example, parts to be assembled into a fluid flow structure include: a first part having a first opening therein and a first adhesive bonding surface surrounding the first opening; a second part having a second opening therein and a second bonding surface surrounding the second opening; and the first and second bonding surfaces are each configured, when the parts are assembled for bonding and an adhesive is squished between the parts, to create a capillary force along the bonding surface urging adhesive away from the opening.

First claim

Opening claim text (preview).

What is claimed is: 1. An assembly for carrying fluid from a first part to a second part, comprising: a first structure having a first conduit for receiving fluid from the first part, a first opening from the first conduit and a first bonding surface surrounding the first opening, the first opening transitioning along a first curve from a smaller interior part of the first opening to a larger exterior part of the first opening that forms at least part of the first bonding surface; a second structure defining a second conduit for receiving fluid from the first conduit and carrying fluid toward the second part, a second opening to the second conduit and a second bonding surface surrounding the second opening, the second opening aligned with the first opening and transitioning along a second curve from a smaller interior part of the second opening to a larger exterior part of the second opening that forms at least part of the second bonding surface; and an adhesive joining together the first and second structures at the first and second bonding surfaces. 2. The assembly of claim 1 , wherein the second curve is symmetrical to the first curve across the joint between the first structure and the second structure. 3. The assembly of claim 2 , wherein the first and second curved bonding surfaces are each free of discontinuities that impede the flow of adhesive when the structures are assembled for bonding and an adhesive is squished between the structures. 4. The assembly of claim 2 , wherein: the first curve is constant around a curvilinear perimeter of the first opening; and the second curve is constant around a curvilinear perimeter of the second opening. 5. The assembly of claim 4 , wherein each curve includes a radius of at least 0.5 mm. 6. The assembly of claim 1 , wherein a radius of the first curve is equal to a radius of the second curve. 7. Parts to be assembled into a fluid flow structure, comprising: a first part having a first opening therein and a curved first adhesive bonding surface surrounding the first opening; a second part having a second opening therein and a curved second bonding surface surrounding the second opening; and the first and second bonding surfaces each configured, when the parts are assembled for bonding and an adhesive is squished between the parts, to create a capillary force along the bonding surface urging adhesive away from the opening, wherein the curved first bonding surface is to align with and be symmetric with the curved second bonding surface when the parts are assembled for bonding. 8. The parts of claim 7 , wherein each bonding surface is also configured to create a reservoir of later gelling adhesive when the parts are assembled for bonding and an adhesive is squished between the parts. 9. The parts of claim 8 , wherein each bonding surface configured to create a reservoir of later gelling adhesive when the parts are assembled for bonding and an adhesive is squished between the parts comprises a curved bonding surface aligned with and symmetrical to the other bonding surface when the parts are assembled for bonding. 10. The parts of claim 7 , wherein: the first curve is constant around a curvilinear perimeter of the first opening; and the second curve is constant around a curvilinear perimeter of the second opening. 11. The parts of claim 10 , wherein each curve includes a radius of at least 0.5 mm. 12. A printhead assembly, comprising: a printhead to dispense liquid; an inlet to receive liquid; a multi-part structure that allows liquid to flow from the inlet to the printhead, the structure including: a first part having a first conduit and a curved first bonding surface surrounding an outlet from the first conduit; a second part having a second conduit, an inlet to the second conduit aligned with the outlet from the first conduit so that liquid may pass from the first conduit to the second conduit, and a curved second bonding surface surrounding the inlet to the second conduit opposite and symmetrical to the first bonding surface; and a first adhesive bonding together the first and second parts along the first and second bonding surfaces. 13. The printhead assembly of claim 12 , wherein: the second conduit also includes an outlet from the second conduit and a third curved bonding surface surrounding the outlet from the second conduit inlet; and the multi-part structure also includes: a third part having a third conduit, an inlet to the third conduit aligned with the outlet from the second conduit so that liquid may pass from the second conduit to the third conduit, and a curved fourth bonding surface surrounding the inlet to the third conduit opposite and symmetrical to the third bonding surface; and a second adhesive bonding together the second and third parts along the third and fourth bonding surfaces. 14. The printhead assembly of claim 12 , wherein a radius of the curved first bonding surface is equal to a radius of the curved second bonding surface.

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Frequently asked questions

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What does patent US9440441B2 cover?
In one example, parts to be assembled into a fluid flow structure include: a first part having a first opening therein and a first adhesive bonding surface surrounding the first opening; a second part having a second opening therein and a second bonding surface surrounding the second opening; and the first and second bonding surfaces are each configured, when the parts are assembled for bonding…
Who is the assignee on this patent?
Hewlett Packard Development Co Lp
What technology area does this patent fall under?
Primary CPC classification B41J2/14024. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 13 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).