Electrical equipment, production method thereof and design method of electrical equipment

Patent metadata

Field	Value
Publication number	US-9439296-B2
Application number	US-201314376847-A
Country	US
Kind code	B2
Filing date	Aug 30, 2013
Priority date	Aug 30, 2013
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

Electrical equipment 1 includes a chassis 2 that has a bottom portion 3 and side portions 4 and 5 , a printed circuit board 10 that is stored in the chassis 2 such that one principal surface 10 a faces an inner surface 3 a of the portion 3 , a sealing resin 20 that is filled in internal space S formed by the chassis 2 and the circuit board 10 , embeds the circuit board 10 , and a flow suppression portion 8 that decreases a drift velocity of the resin 20 pressed into the space S through the resin injection hole 11 , and that is provided in at least part of region A from a position immediately below the hole 11 in the inner surface 3 a to an inner surface 4 a of a side portion 4 closest to the hole 11 out of the side portions 4 and 5.

First claim

The invention claimed is:

1. Electrical equipment comprising:
a chassis that has a bottom portion and a plurality of side portions and is opened upward;
a printed circuit board in which a resin injection hole that penetrates in a thickness direction is provided, and that is stored in the chassis such that one principal surface faces an inner surface of the bottom portion;
a sealing resin that is filled in an internal space formed by the chassis and the printed circuit board, coats the other principal surface of the printed circuit board and embeds the printed circuit board; and
a flow suppression portion that decreases a drift velocity of the sealing resin pressed into the internal space through the resin injection hole before the sealing resin is hardened, and that is provided in at least part of a region from a position immediately below the resin injection hole in the inner surface of the bottom portion to an inner surface of a side portion closest to the resin injection hole among the plurality of side portions.

2. The electrical equipment according to claim 1 , wherein a plurality of ribs that are in contact with the inner surface of the side portion closest to the resin injection hole and extend to an upper side of the printed circuit board along a direction in which the side portion stands from the bottom portion are provided as the flow suppression portion.

3. The electrical equipment according to claim 2 , wherein an interval between the ribs becomes wider with increasing distance from the resin injection hole.

4. The electrical equipment according to claim 2 , wherein a width of the rib becomes narrower with increasing distance from the resin injection hole.

5. The electrical equipment according claim 2 , wherein the chassis has a substantially rectangular shape in plan view, the resin injection hole is provided in a central portion of the printed circuit board and the plurality of ribs are provided in at least one side portion corresponding to a long side among the plurality of side portions of the chassis.

6. The electrical equipment according to claim 1 , wherein a rib that is in contact with the inner surface of the bottom portion of the chassis and extends along the side portion closest to the resin injection hole is provided as the flow suppression portion.

7. The electrical equipment according to claim 6 , wherein the rib has a top portion and an inclination portion that is provided in an opposite side to a position immediately below the resin injection hole and inclines from the top portion toward the inner surface of the bottom portion of the chassis.

8. The electrical equipment according to claim 1 , wherein concavities and convexities formed by surface texturing are provided in the inner surface of the chassis as the flow suppression portion.

9. The electrical equipment according to claim 1 , wherein an air bubble escape hole that penetrates through the printed circuit board in a thickness direction is provided near an edge side of the printed circuit board, between the resin injection hole and a side portion different from the side portion closest to the resin injection hole.

10. The electrical equipment according to claim 1 , wherein the chassis has a substantially polygonal shape in plan view and a depth of a corner portion of the chassis is shallower than a central portion of the bottom portion.

11. The electrical equipment according to claim 1 , wherein an electronic part is mounted on the one principal surface of the printed circuit board and the flow suppression portion is provided in consideration of a size of the electronic part.

12. A production method of electrical equipment comprising:
preparing a printed circuit board in which a resin injection hole that penetrates in a thickness direction is provided and an electronic part is mounted on one principal surface;
preparing a chassis that has a bottom portion and a plurality of side portions and is opened upward, where a flow suppression portion that decreases a drift velocity of a resin pressed into an internal space, which is formed by the chassis and the printed circuit board when the printed circuit board is stored, through the resin injection hole is provided in at least part of a region from an inner surface of the bottom portion immediately below the resin injection hole to an inner surface of a side portion closest to the resin injection hole among the plurality of side portions;
storing the printed circuit board in the chassis such that the one principal surface faces the inner surface of the bottom portion; and
a sealing step of pressing a resin through the resin injection hole and hardening the resin after embedding the electronic part and the printed circuit board with the resin.

13. The production method of the electrical equipment according to claim 12 , further comprising using a chassis in which a plurality of ribs that are in contact with the inner surface of the side portion closest to the resin injection hole in a state where the printed circuit board is stored in the chassis and that stand from the inner surface of the bottom surface to an upper side of the printed circuit board are provided as the flow suppression portion.

14. A design method of electrical equipment comprising a chassis that has a bottom portion and a plurality of side portions and is opened upward, a printed circuit board in which a resin injection hole that penetrates in a thickness direction is provided, and that is stored in the chassis such that one principal surface faces an inner surface of the bottom portion, and a sealing resin that is filled in the chassis and embeds the printed circuit board, where a flow suppression portion that decreases a drift velocity of the sealing resin pressed into an internal space, which is formed by the chassis and the printed circuit board when the printed circuit board is stored in the chassis, through the resin injection hole before the sealing resin is hardened, is provided in at least part of a region from the inner surface of the bottom portion immediately below the resin injection hole to an inner surface of a side portion closest to the resin injection hole among the plurality of side portions.

15. The design method of the electrical equipment according to claim 14 , wherein a plurality of ribs that are in contact with the inner surface of the side portion closest to the resin injection hole and stand from the inner surface of the bottom portion to an upper side of the printed circuit board are provided as the flow suppression portion.

Assignees

• Shindengen Electric Mfg

Inventors

• Akashi Tomoya

Classifications

• G06F2113/22

  Moulding · CPC title

• H05K2203/1327

  Moulding over PCB locally or completely · CPC title

• H05K3/284 Primary

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K7/04

  on conductive chassis · CPC title

• G06F30/39

  Circuit design at the physical level (physical level design for reconfigurable circuits G06F30/347) · CPC title