Wafer processing apparatus for combined high-pressure process and vacuum process, and wafer processing method using decompression
US-2024339338-A1 · Oct 10, 2024 · US
US9437463B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9437463-B2 |
| Application number | US-201313863729-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 16, 2013 |
| Priority date | Oct 25, 2010 |
| Publication date | Sep 6, 2016 |
| Grant date | Sep 6, 2016 |
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A heating apparatus includes a susceptor having a heating face of heating a semiconductor and a supporting part joined with a back face of the susceptor. The susceptor comprises a ceramic material comprising magnesium, aluminum, oxygen and nitrogen as main components. The material comprises a main phase comprising magnesium-aluminum oxynitride phase exhibiting an XRD peak at least in 2θ=47 to 50° by CuKα X-ray.
Opening claim text (preview).
The invention claimed is: 1. A heating apparatus for a semiconductor manufacturing system comprising: a susceptor comprising a heating face of heating a semiconductor and a back face and a supporting part bonded with said back face of said susceptor, wherein said susceptor comprises a ceramic material comprising magnesium, aluminum, oxygen and nitrogen as main components, and wherein said ceramic material comprises at least 50 vol % magnesium-aluminum oxynitride phase exhibiting an XRD peak at least in 2θ=47 to 50° taken by using CuKα ray. 2. The heating apparatus of claim 1 , wherein said supporting part comprises said ceramic material. 3. The heating apparatus of claim 1 , further comprising: a heat generator embedded in said susceptor; and an electrical supplying member contained in an inner space of said supporting part and electrically connected to said heat generator. 4. The heating apparatus of claim 1 , wherein said 2θ is 47 to 49°. 5. The heating apparatus of claim 1 , said ceramic material comprising a sub phase comprising a crystal phase of MgO—AlN solid solution wherein aluminum nitride is dissolved into magnesium oxide. 6. The heating apparatus of claim 5 , wherein said MgO—AlN solid solution has XRD peaks at (200) and (220) faces taken by using CuKα ray in ranges of 2θ=42.9 to 44.8° and 62.3 to 65.2° , respectively, which are between peaks of cubic phase of magnesium oxide and cubic phase of aluminum nitride, respectively. 7. The heating apparatus of claim 5 , wherein said MgO—AlN solid solution has an XRD peak at (111) face taken by using CuKα ray in a range of 2θ=36.9 to 39° , which is between peaks of cubic phase of magnesium oxide and cubic phase of aluminum nitride. 8. The heating apparatus of claim 1 , wherein said ceramic material does not contain AlN crystal phase. 9. The heating apparatus of claim 1 , wherein a magnesium source in raw materials used for producing said ceramic material comprises MgO. 10. The heating apparatus of claim 1 , wherein said ceramic material has an open porosity of 0.12% or lower.
using electrostatic chucks · CPC title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title
of insulating materials · CPC title
of Group IV materials · CPC title
based on borides, nitrides, {i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides} or silicides {(containing free binder metal C22C29/00)} · CPC title
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