Slurry for chemical mechanical polishing and chemical mechanical polishing method

Patent metadata

Field	Value
Publication number	US-9437446-B2
Application number	US-201314404528-A
Country	US
Kind code	B2
Filing date	May 27, 2013
Priority date	May 30, 2012
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

The present invention provides a slurry for chemical mechanical polishing, containing abrasive grain (a), compound (b) having an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and water.

First claim

The invention claimed is:

1. A slurry for chemical mechanical polishing, comprising
abrasive grain (a),
compound (b) comprising an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and
water.

2. The slurry according to claim 1 , wherein
a concentration of the abrasive grain (a) is 0.1-20 mass %, and
a concentration of the compound (b) is 0.001-1 mass %.

3. The slurry according to claim 1 , wherein the abrasive grain (a) is at least one selected from the group consisting of cerium oxide, manganese oxide, iron oxide, titanium oxide, magnesium oxide, zirconium oxide and tantalum oxide.

4. The slurry according to claim 1 , wherein the pKa of the amino group of the compound (b) is 9.2-10.5.

5. The slurry according to claim 1 , wherein the compound (b) comprises one amino group.

6. The slurry according to claim 1 , wherein the compound (b) has a molecular weight of 100-1000.

7. The slurry according to claim 1 , wherein the compound (b) is glucamine and/or a derivative thereof.

8. The slurry according to claim 1 , further comprising
a water-soluble polymer (c) at a concentration of 0.001-5 mass %.

9. The slurry according to claim 8 , wherein the water-soluble polymer (c) is an anionic polymer and/or a non-ionic polymer.

10. The slurry according to claim 8 , wherein the water-soluble polymer (c) is at least one selected from the group consisting of
a water-soluble polymer (c1) obtained by polymerizing 25-100 mass % of at least one monomer selected from the group consisting of (meth)acrylic acid, maleic acid, itaconic acid and vinylpyrrolidone, and 75-0 mass % of other monomer comprising an unsaturated double bond;
a water-soluble polymer (c2) obtained by polymerizing 50-100 mass % of a monomer that forms a vinyl alcohol skeleton by hydrolysis and 50-0 mass % of other monomer comprising an unsaturated double bond, which is followed by hydrolysis;
a water-soluble polysaccharide (c3);
a water-soluble polyurethane (c4) comprising a carboxy group and/or a polyoxyethylene group; and
a water-soluble derivative thereof (c5).

11. The slurry according to claim 1 , further comprising
a compound (d) comprising a structure of formula (1) or (2) at a concentration of 0.0001-1 mass %

wherein R 1 , R 2 and R 3 are each independently an alkylene group comprising 1-6 carbon atoms,
R 4 is a hydrogen atom or an alkyl group comprising 1-3 carbon atoms, and
n is an integer of 0-9.

12. The slurry according to claim 11 , wherein the compound (d) is at least one selected from the group consisting of iminodiacetic acid, N-(2-hydroxyethyl)iminodiacetic acid, aspartic acid-N,N-diacetic acid, nitrilotriacetic acid, N-(2-hydroxyethyl)ethylenediamine-N,N′,N′-triacetic acid, ethylenediamine-N,N,N′,N′-tetraacetic acid, propylenediamine-N,N,N′,N′-tetraacetic acid, glycol etherdiamine-N,N,N′,N′-tetraacetic acid, 1,2-diaminocyclohexane-N,N,N′,N′-tetraacetic acid, diethylenetriamine-N,N,N′,N″,N″-pentaacetic acid, triethylenetetramine-N,N,N′,N″,N′″,N′″-hexaacetic acid, 3-hydroxy-2,2′-iminodisuccinic acid and ethylenediamine disuccinic acid.

13. The slurry according to claim 1 , having pH of 3-11.

14. A method of chemical mechanical polishing, the method comprising
polishing an insulating film by using the slurry according to claim 1 .

15. The method according to claim 14 , wherein a shallow trench isolation is formed.

Assignees

• Kuraray Co

Inventors

• Kato Mitsuru
• Okamoto Chihiro
• Kato Shinya

Classifications

• H10P95/062 Primary

  involving a dielectric removal step · CPC title

• H10W10/17

  formed using trench refilling with dielectric materials, e.g. shallow trench isolations · CPC title

• H10W10/014

  using trench refilling with dielectric materials, e.g. shallow trench isolations · CPC title

• H10W10/011

  of isolation regions comprising dielectric materials · CPC title

• H10W10/10

  Isolation regions comprising dielectric materials · CPC title