Power mosfet and manufacturing method thereof
US-2024322032-A1 · Sep 26, 2024 · US
US9437424B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9437424-B2 |
| Application number | US-12366408-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 20, 2008 |
| Priority date | Dec 22, 2005 |
| Publication date | Sep 6, 2016 |
| Grant date | Sep 6, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
High mobility P-channel power metal oxide semiconductor field effect transistors. In accordance with an embodiment of the present invention, a power MOSFET is fabricated such that the holes flow in an inversion/accumulation channel, which is along the (110) crystalline plane, or equivalents, and the current flow is in the [110] direction, or equivalents, when a negative potential is applied to the gate with respect to the source. The enhanced channel mobility of holes leads to a reduction of the channel portion of the on-state resistance, thereby advantageously reducing total “on”resistance of the device.
Opening claim text (preview).
What is claimed is: 1. A method comprising: utilizing a silicon wafer having a surface orientation in a direction; etching a trench in a (110) plane of said wafer, wherein said etching comprises etching a plurality of perpendicular trenches bounded by (100) planes; forming first and second source regions adjacent to and parallel to each long edge of said trench; and forming a gate structure in said trench between said first and second source regions. 2. The method of claim 1 wherein said plurality of perpendicular trenches form closed cells. 3. A trench MOSFET comprising: a silicon wafer including a surface orientation in a direction; a trench formed in said silicon wafer in a (110) plane; a plurality of perpendicular trenches bounded by (110) planes; first and second source regions adjacent to and parallel to each long edge of said trench; and a gate structure in said trench between said first and second source regions. 4. The trench MOSFET of claim 3 wherein said plurality of perpendicular trenches form closed cells.
Crystal orientation · CPC title
Crystal orientation · CPC title
Crystal orientations · CPC title
having trench gate electrodes, e.g. UMOS transistors · CPC title
Body regions of DMOS transistors or IGBTs (cell layout of DMOS H10D62/127) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.