Method of manufacturing a winding-type solid electrolytic capacitor package structure without using a lead frame

Patent metadata

Field	Value
Publication number	US-9437367-B2
Application number	US-201514840281-A
Country	US
Kind code	B2
Filing date	Aug 31, 2015
Priority date	Mar 18, 2013
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.

First claim

What is claimed is:

1. A method of manufacturing a winding-type solid electrolytic capacitor package structure without using a lead frame, comprising: providing at least one winding capacitor, wherein the at least one winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body; forming a package body to enclose the winding body, wherein the positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion connected with the first embedded portion and exposed outside the package body, and the negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion connected with the second embedded portion and exposed outside the package body; and bent the first exposed portion and the second exposed portion along an outer surface of the package body;
wherein the positive conductive lead in has a first positive conductive portion, a second positive conductive portion, and a first soldering portion connected between the first positive conductive portion and the second positive conductive portion, the second positive conductive portion is a first multilayer structure composed of a plurality of first material layers, and the negative conductive lead in is a second multilayer structure composed of a plurality of second material layers.

2. The method of claim 1 , wherein the winding body has a positive foil sheet, a negative foil sheet and an isolation paper disposed between the positive foil sheet and the negative foil sheet, the positive foil sheet, the negative foil sheet and the isolation paper are rolled to form a cuboid capacitor core, and the positive conductive lead pin and the negative conductive lead pin respectively electrically contact the positive foil sheet and the negative foil sheet.

3. The method of claim 2 , wherein the first positive conductive portion electrically contacts the positive foil sheet, the first positive conductive portion is made of a pure Al material or an Al alloy material, wherein the innermost first material layer is a Fe layer or a Cu layer, the outermost first material layer is an Sn layer surrounding the Fe layer or the Cu layer, the innermost second material layer is a pure Al layer or an Al alloy layer, and the outermost second material layer is an Sn layer surrounding the pure Al layer or the Al alloy layer.

4. The method of claim 2 , wherein both the innermost first material layer and the innermost second material layer are two pure Al layers or Al alloy layers, and both the outermost first material layer and the outermost second material layer are two Sn layers respectively surrounding the two pure Al layers or the two Al alloy layers.

5. The method of claim 2 , wherein the first positive conductive portion electrically contacts the positive foil sheet, the negative conductive lead pin has a first negative conductive portion electrically contacting the negative foil sheet, a second negative conductive portion, and a second soldering portion connected between the first negative conductive portion and the second negative conductive portion, both the first positive conductive portion and the first negative conductive portion are made of a pure Al material or an Al alloy material, wherein both the innermost first material layer and the inner most second material layer are two Fe layers or two Cu layers, and both the outermost first material layer and the outermost second material layer are two Sn layers respectively surrounding the two Fe layers or the two Cu layers.

6. The method of claim 1 , wherein the at least one winding capacitor is processed by a carbonization process, a formation process and a polymer-impregnated process in sequence in the step of providing the at least one winding capacitor, and the at least one winding capacitor is processed by an ageing process after the step of forming the package body to enclose the winding body.

7. The method of claim 1 , further comprising: flattening the top side and the bottom side of the first exposed portion and the top side and the bottom side of the second exposed portion, wherein the first exposed portion has a first flattening surface and a second flattening surface respectively formed on the top side and the bottom side thereof, and the second exposed portion has a first flattening surface and a second flattening surface respectively formed on the top side and the bottom side thereof.

8. The method of claim 7 , wherein the package body has a first lateral surface, a second lateral surface opposite to the first lateral surface, and a bottom surface connected between the first lateral surface and the second lateral surface, the first exposed portion is extended along the first lateral surface and the bottom surface of the package body, and the second exposed portion is extended along the second lateral surface and the bottom surface of the package body, wherein the second flattening surface of the first exposed portion is directed toward the first lateral surface and the bottom surface of the package body, and the first flattening surface of the first exposed portion is opposite to the first lateral surface and the bottom surface of the package body, wherein the second flattening surface of the second exposed portion is directed toward the second lateral surface and the bottom surface of the package body, and the first flattening surface of the second exposed portion is opposite to the second lateral surface and the bottom surface of the package body.

Assignees

• Apaq Technology Co Ltd

Inventors

• Chen Ming-Tsung
• Lin Ching-Feng

Classifications

• H01G9/012

  specially adapted for solid capacitors · CPC title

• Y10T29/417

  Cross-Sectional Technologies · mapped topic

• H01G2009/0018

  Electricity · mapped topic

• H01G9/0029 Primary

  Processes of manufacture · CPC title

• H01G2009/0014

  Electricity · mapped topic