Polycrystalline diamond compact including a substrate having a raised interfacial surface bonded to a polycrystalline diamond table, and applications therefor

Patent metadata

Field	Value
Publication number	US-9435160-B2
Application number	US-201414445931-A
Country	US
Kind code	B2
Filing date	Jul 29, 2014
Priority date	Mar 2, 2010
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

A polycrystalline diamond compact (“PDC”) comprises a substrate including an interfacial surface having a raised region. In an embodiment, a PDC comprises a substrate including an interfacial surface having a generally cylindrical raised region and a peripheral region extending about the generally cylindrical raised region. The generally cylindrical raised region extends to a height above the peripheral region of about 450 μm or less. The PDC includes a PCD table bonded to the interfacial surface of the substrate. The PCD table includes an upper surface and at least one peripheral surface, and includes a plurality of bonded diamond grains defining interstitial regions. At least a portion of the interstitial regions includes a metallic constituent therein.

First claim

What is claimed is:

1. A polycrystalline diamond compact, comprising:
a substrate including an interfacial surface having a raised region and a peripheral region extending about the raised region, the raised region having an upper surface at a height above the peripheral region, the height being greater than 0 μm and less than about 450 μm; and
a polycrystalline diamond table bonded to the interfacial surface of the substrate and integrally formed with the substrate, the polycrystalline diamond table including an upper surface and at least one peripheral surface, the polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions, the polycrystalline diamond table including:
an unleached first region adjacent to the substrate in which at least a portion of the plurality of interstitial regions of the first region includes a metallic constituent disposed in the unleached first region; and
a leached second region from which the metallic constituent is depleted, the second region extending inwardly from the upper surface, at least a portion of the second region as measured from the upper surface of the polycrystalline diamond table extending past the upper surface of the raised region.

2. The polycrystalline diamond compact of claim 1 wherein the height of the raised region is about 250 μm to about 355 μm above the peripheral region of the substrate.

3. The polycrystalline diamond compact of claim 1 wherein the upper surface of the polycrystalline diamond table is at a first height of about 950 μm or less above the peripheral region of the substrate.

4. The polycrystalline diamond compact of claim 3 wherein the upper surface of the polycrystalline diamond table is at a second height of about 500 μm or less above the raised region of the substrate.

5. The polycrystalline diamond compact of claim 4 wherein the ratio of the second height to the height is about 1.1 to about 3.

6. The polycrystalline diamond compact of claim 5 wherein the second region extends along a peripherally-extending chamfer that extends between the at least one peripheral surface and the upper surface of the polycrystalline diamond table.

7. The polycrystalline diamond compact of claim 1 wherein the at least one peripheral surface exhibits a width of about 200 μm to about 1270 μm.

8. The polycrystalline diamond compact of claim 7 wherein the at least one peripheral surface exhibits a width of about 250 μm to about 350 μm.

9. The polycrystalline diamond compact of claim 1 wherein a ratio of the height of the raised region to the width of the peripheral region is about 1.1 or less.

10. The polycrystalline diamond compact of claim 1 wherein a ratio of the volume of the raised region to the volume of the polycrystalline diamond table is greater than or equal to 0.15.

11. The polycrystalline diamond compact of claim 1 wherein a ratio of a maximum height of the raised region to a maximum thickness of the polycrystalline diamond table is greater than or equal to 0.40.

12. The polycrystalline diamond compact of claim 1 wherein a surface area of the raised region comprises at least 60 percent of a total surface area of the interfacial surface of the substrate.

13. The polycrystalline diamond compact of claim 1 wherein the raised region of the substrate is generally centrally located.

14. The polycrystalline diamond compact of claim 1 wherein the metallic constituent comprises at least one of a metal-solvent catalyst or a metallic infiltrant.

15. A polycrystalline diamond compact, comprising:
a substrate including an interfacial surface having a raised region and a peripheral region extending about the raised region, the raised region having an upper surface at a first height above the peripheral region, the first height being greater than 0 μm and less than about 450 μm, wherein a surface area of the raised region comprises at least 60 percent of a total surface area of the interfacial surface of the substrate; and
a polycrystalline diamond table bonded to the interfacial surface of the substrate and integrally formed with the substrate, the polycrystalline diamond table including an upper surface at a second height of less than 950 μm above the peripheral region of the substrate and at least one peripheral surface, the polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions, the polycrystalline diamond table including:
an unleached first region adjacent to the substrate in which at least a portion of the plurality of interstitial regions of the first region includes a metallic constituent disposed in the unleached first region; and
a leached second region from which the metallic constituent is depleted that extends about 100 μm to about 500 μm inwardly from the upper surface, at least a portion of the second region as measured from the upper surface of the polycrystalline diamond table extending past the upper surface of the raised region.

16. The polycrystalline diamond compact of claim 15 wherein the upper surface of the polycrystalline diamond table is at a third height of about 500 μm or less above the peripheral region of the substrate.

17. The polycrystalline diamond compact of claim 15 wherein a ratio of a thickness of the polycrystalline diamond table over the raised region of the substrate to a maximum leach depth of the leached second region is about 1.25 to about 4.0.

18. A rotary drill bit, comprising:
a bit body configured to engage a subterranean formation; and
a plurality of polycrystalline diamond cutting elements affixed to the bit body, at least one of the polycrystalline diamond cutting elements including:
a substrate including an interfacial surface having a raised region and a peripheral region extending about the raised region, the raised region having an upper surface at a height above the peripheral region, the height being greater than 0 μm and less than about 450 μm; and
a polycrystalline diamond table bonded to the interfacial surface of the substrate and integrally formed with the substrate, the polycrystalline diamond table including an upper surface and at least one peripheral surface, the polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions, the polycrystalline diamond table including:
an unleached first region adjacent to the substrate in which at least a portion of the plurality of interstitial regions of the first region includes a metallic constituent disposed in the unleached first region; and
a leached second region from which the metallic constituent is depleted that extends inwardly from the upper surface, at least a portion of the leach region as measured from the upper surface of the polycrystalline diamond table extending past the upper surface of the raised region.

19. The rotary drill bit of claim 18 wherein a surface area of the raised region comprises at least 60 percent of a total surface area of the interfacial surface of the substrate.

20. The rotary drill bit of claim 18 wherein a ratio of a thickness of the polycrystalline diamond table over the raised region of the substrate to a maximum leach depth of the leached second region is about 1.25 to about 4.0.

Assignees

• Us Synthetic Corp

Inventors

• Gonzalez Jair J
• Haddock Neil D

Classifications

• B24D3/10

  for porous or cellular structure, e.g. for use with diamonds as abrasives · CPC title

• B24D99/005

  Segments of abrasive wheels · CPC title

• B22F2003/244

  Leaching · CPC title

• C22C26/00

  Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

• C22C2204/00

  End product comprising different layers, coatings or parts of cermet · CPC title