Mechanically flexible and durable substrates

Patent metadata

Field	Value
Publication number	US-9434642-B2
Application number	US-80486507-A
Country	US
Kind code	B2
Filing date	May 21, 2007
Priority date	May 21, 2007
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm) −1/2 , or b) a fracture toughness of at least about 0.75 MPa·(m) 1/2 . Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm) −1/2 , or b) a fracture toughness of at least about 0.75 MPa·(m) 1/2 ; and then forming a substrate from the selected inorganic material.

First claim

What is claimed is:

1. A substrate comprising an alkali-free amorphous inorganic composition, wherein the substrate has a thickness of from about 1 μm to less than about 250 μm and at least one of:
a) a brittleness ratio of less than about 9.5 (μm) −1/2 , or
b) a fracture toughness of at least about 0.75 MPa·(m) 1/2 and wherein the substrate has a bend radius of less than about 30 cm.

2. The substrate of claim 1 , wherein the substrate has a brittleness ratio of less than about 8 (μm) −1/2 .

3. The substrate of claim 1 , wherein the substrate has a fracture toughness of at least about 0.9 MPa·(m) 1/2 .

4. The substrate of claim 1 , wherein the substrate has at least one of:
a) a brittleness ratio of from about 0.1 (μm) −1/2 to less than about 9.5 (μm) −1/2 , or
b) a fracture toughness of from about 0.75 MPa·(m) 1/2 to about 10 MPa·(m) 1/2 .

5. The substrate of claim 1 , wherein the substrate has a modulus; and wherein the product of the substrate modulus and the substrate thickness is less than about 2.0 GPa·cm.

6. The substrate of claim 5 , wherein the product of the substrate modulus and the substrate thickness is less than about 1.0 GPa·cm.

7. The substrate of claim 1 , wherein the substrate has both a brittleness ratio of less than about 9.5 (μm) −1/2 and a fracture toughness of at least about 0.75 MPa·(m) 1/2 .

8. The substrate of claim 1 , wherein the substrate has both a brittleness ratio of less than about 9.5 (μm) −1/2 and a fracture toughness of at least about 0.75 MPa·(m) 1/2 ; wherein the substrate has a modulus; and wherein the product of the substrate modulus and the substrate thickness is less than about 2 GPa·cm.

9. The substrate of claim 1 , wherein the substrate has both a brittleness ratio of less than about 8.0 (μm) −1/2 and a fracture toughness of at least about 0.9 MPa·(m) 1/2 ; wherein the substrate has a modulus; and wherein the product of the substrate modulus and the substrate thickness is less than about 2 GPa·cm.

10. The substrate of claim 1 , wherein the substrate has a fatigue value, n, greater than about 29.

11. The substrate of claim 1 , wherein the substrate has a fatigue value, n, greater than about 38.

12. The substrate of claim 1 , wherein the composition comprises a glass, a glass-ceramic, or a combination thereof.

13. The substrate claim 1 , wherein the substrate has a bend radius of less than about 2 cm.

14. The substrate of claim 1 , further comprising a coating positioned on at least a portion of at least one surface of the substrate.

15. The substrate of claim 1 , wherein the substrate is fusion- drawn.

16. The substrate of claim 1 , wherein the substrate is a borosilicate glass.

17. The substrate of claim 16 , wherein the borosilicate glass is an alumino-borosilicate glass.

18. An electric device comprising a flexible substrate comprising an alkali-free amorphous inorganic composition, wherein the substrate has a thickness of from about 1 μm to less than about 250 μm and at least one of:
a) a brittleness ratio of less than about 9.5 (μm) −1/2 , or
b) a fracture toughness of at least about 0.75 MPa·(m) 1/2 and wherein the substrate has a bend radius of less than about 30 cm.

19. The electronic device of claim 18 , wherein the substrate has a modulus; and wherein the product of the substrate modulus and the substrate thickness is less than about 2.0 GPa·cm.

20. The electronic device of claim 18 , wherein the electronic device comprises a light emitting display.

21. The electronic device of claim 18 , wherein the electronic device comprises an organic light emitting display device.

22. The electronic device of claim 18 , wherein the device is a display device.

Assignees

• Garner Sean Matthew
• Glaesemann Gregory Scott
• Price James Joseph
• Corning Inc

Inventors

• Garner Sean Matthew
• Glaesemann Gregory Scott
• Price James Joseph

Classifications

• C03C4/00 Primary

  Compositions for glass with special properties · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• C03C17/34 Primary

  with at least two coatings having different compositions (C03C17/44 takes precedence) · CPC title

• H10F77/1698

  the metallic or insulating substrates being flexible · CPC title

• H01L2251/5338

  Electricity · mapped topic