Chip layout to enable multiple heater chip vertical resolutions

Patent metadata

Field	Value
Publication number	US-9434165-B2
Application number	US-201414472297-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Aug 28, 2014
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

An inkjet printer including a printhead with a fluid ejection chip and an associated method of forming is described. The fluid ejection chip includes a substrate, a plurality of groups of drive elements formed on the substrate, and a plurality of fluid ejection devices disposed on the substrate. Each group of drive elements includes at least two drive elements electrically coupled in parallel. Each fluid ejection device of the plurality of fluid ejection devices is electrically coupled with a respective group of the plurality of groups of drive elements so that the plurality of drive elements selectively activate the plurality of fluid ejection devices for causing fluid to be expelled from the printhead in accordance with image data.

First claim

The invention claimed is:

1. A method of fabricating a fluid ejection chip, comprising:
providing a substrate;
forming a plurality of drive elements on the substrate;
forming a plurality of groups of drive elements, each group comprising at least two drive elements of the plurality of drive elements electrically coupled in parallel;
forming a plurality of fluid ejection devices on the substrate; and
electrically coupling each fluid ejection device of the plurality of fluid ejection devices with a single respective group of the plurality of groups of drive elements so that the plurality of drive elements selectively supply electrical power to the plurality of fluid ejection devices for causing fluid to be expelled from the fluid ejection chip in accordance with image data.

2. The method of claim 1 , further comprising the step of forming a via on the substrate that provides fluid communication between the fluid ejection devices and a fluid supply.

3. The method of claim 1 , wherein the plurality of drive elements comprise transistors.

4. The method of claim 1 , wherein the step of electrically coupling each fluid ejection device with a single respective group of drive elements comprises depositing an electrical interconnect on the substrate.

5. The method of claim 1 , wherein each group comprises four drive elements.

6. A printhead comprising a fluid ejection chip formed by the method of claim 1 .

7. A fluid ejection chip comprising;
a substrate;
a plurality of groups of drive elements formed on the substrate, each group comprising at least two drive elements electrically coupled in parallel; and
a plurality of fluid ejection devices disposed on the substrate, each fluid ejection device of the plurality of fluid ejection devices electrically coupled with a single respective group of the plurality of groups of drive elements so that the plurality of drive elements selectively supply electrical power to the plurality of fluid ejection devices for causing fluid to be expelled from the fluid ejection chip in accordance with image data.

8. The fluid ejection chip of claim 7 , wherein the substrate further comprises a via that provides fluid communication between the fluid ejection devices and a fluid supply.

9. The fluid ejection chip of claim 8 , wherein each fluid ejection device of the plurality of fluid ejection devices is vertically spaced a uniform distance from a vertically-adjacent fluid ejection device along the via.

10. The fluid ejection chip of claim 9 , wherein the plurality of fluid ejection devices is formed in two columns, each column on an opposing side of the via.

11. The fluid ejection chip of claim 10 , wherein each column is vertically offset from the other column.

12. The fluid ejection chip of claim 11 , wherein each column is vertically offset from the other column by a distance that is half a uniform vertical distance between each vertically-adjacent fluid ejection device of the plurality of fluid ejection devices.

13. The fluid ejection chip of claim 7 , wherein the plurality of groups of drive elements comprises transistors.

14. The fluid ejection chip of claim 7 , wherein each group comprises four drive elements electrically coupled in parallel.

15. An inkjet printer comprising:
a housing;
a carriage adapted to reciprocate along a shaft disposed within the housing;
one or more printhead assemblies arranged on the carriage so that the one or more printhead assemblies eject ink onto a print medium as the carriage reciprocates along the shaft in accordance with a control mechanism, wherein at least one of the one or more printhead assemblies comprises:
a printhead comprising:
a fluid ejection chip comprising;
a substrate;
a plurality of groups of drive elements formed on the substrate, each group comprising at least two drive elements electrically coupled in parallel; and
a plurality of fluid ejection devices disposed on the substrate, each fluid ejection device of the plurality of fluid ejection devices electrically coupled with a single respective group of the plurality of groups of drive elements so that the plurality of drive elements selectively supply electrical power to the plurality of fluid ejection devices for causing ink to be expelled from the printhead in accordance with image data.

16. The inkjet printer of claim 15 , wherein the substrate further comprises a via that provides fluid communication between the fluid ejection devices and a fluid supply.

17. The inkjet printer of claim 16 , wherein each fluid ejection device of the plurality of fluid ejection devices is vertically spaced a uniform distance from a vertically-adjacent fluid ejection device along the via.

18. The inkjet printer of claim 17 , wherein the plurality of fluid ejection devices is formed in two columns, each column on an opposing side of the via.

19. The inkjet printer of claim 18 , wherein each column is vertically offset from the other column.

20. The inkjet printer of claim 15 , wherein each group comprises four drive elements electrically coupled in parallel.

Assignees

• Funai Electric Co

Inventors

• Edelen John Glenn
• Semler Nicole
• Marra Michael

Classifications

• B41J2/14129

  Layer structure · CPC title

• B41J2/1603

  of the front shooter type · CPC title

• B41J2/1628

  dry etching · CPC title

• B41J2/1631

  photolithography · CPC title

• B41J2/1629

  wet etching · CPC title