Planarization device and planarization method using the same

Patent metadata

Field	Value
Publication number	US-9434045-B2
Application number	US-201414269370-A
Country	US
Kind code	B2
Filing date	May 5, 2014
Priority date	May 5, 2014
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm.

First claim

What is claimed is:

1. A planarization device, comprising:
a platen;
a grinding pad disposed on the platen;
an operation arm having a lower surface;
a chuck rotatably disposed on the operation arm; and
a first shielding pad detachably disposed on the lower surface of the operation arm;
wherein a thickness of the first shielding pad is larger than a gap between the operation arm and the chuck, and wherein the first shielding pad extends below an upper surface of the chuck.

2. The planarization device according to claim 1 , wherein the first shielding pad is extended within the gap.

3. The planarization device according to claim 1 , wherein the first shielding pad has a notch, and an inner diameter of the notch is larger than an outer diameter of the chuck.

4. The planarization device according to claim 1 , wherein the first shielding pad has a notch, and an inner diameter of the notch is less than an outer diameter of the chuck.

5. The planarization device according to claim 1 wherein the first shielding pad has a notch, and a bottom surface of the notch is separated from a lateral surface of the chuck by an interval.

6. The planarization device according to claim 1 , wherein the first shielding pad has a notch, and the planarization device further comprises:
a second shielding pad disposed between the operation arm and the chuck and located within the notch of the first shielding pad.

7. The planarization device according to claim 1 , wherein further comprises:
a locking component fixing a relative position between the first shielding pad and the operation arm.

8. The planarization device according to claim 7 , wherein the first shielding pad has a recess and a through hole, the through hole penetrates the first shielding pad from a bottom surface of the recess, the locking component passes through the through hole to fix the first shielding pad to the operation arm, and an end of the locking component is received within the recess.

9. A planarization method for semiconductor structure, comprising:
providing a planarization device according to claim 1 ;
providing a semiconductor structure, wherein the semiconductor structure comprises a substrate and a layer structure formed on the substrate;
the chuck picking up the semiconductor structure; and
the chuck driving the layer structure of the semiconductor structure to rotate and touch the grinding pad for planarizing the layer structure.

10. The planarization method according to claim 9 , wherein the first shielding pad is extended within the gap.

11. The planarization method according to claim 9 , wherein the first shielding pad has a notch, and an inner diameter of the notch is larger than an outer diameter of the chuck.

12. The planarization method according to claim 9 , wherein the first shielding pad has a notch, and an inner diameter of the notch is less than an outer diameter of the chuck.

13. The planarization method according to claim 9 wherein the first shielding pad has a notch, and a bottom surface of the notch is separated from a lateral surface of the chuck by an interval.

14. The planarization method according to claim 9 , wherein the first shielding pad has a notch, and the planarization device further comprises:
a second shielding pad disposed between the operation arm and the chuck and located within the notch of the first shielding pad.

15. The planarization method according to claim 9 , wherein the planarization device further comprises:
a locking component fixing a relative position between the first shielding pad and the operation arm.

16. The planarization method according to claim 15 , wherein the first shielding pad has a recess and a through hole, the through hole penetrates the first shielding pad from a bottom surface of the recess, the locking component pass through the through hole to fix the first shielding pad to the operation arm, and an end of the locking component is received within the recess.

Assignees

• Macronix Int Co Ltd

Inventors

• Yeh Yu-Hua
• Hu Liang-Yu
• Chang Tang-Tsai
• Lai Ming-Tsan

Classifications

• B24B37/04 Primary

  designed for working plane surfaces · CPC title

• B24B37/34

  Accessories · CPC title

• B24B55/00

  Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition (of general applicability for machine tools B23Q11/00; in general F16P) · CPC title

• B24B37/042 Primary

  operating processes therefor · CPC title

• B24B37/105

  the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement · CPC title