Patch package structure

Patent metadata

Field	Value
Publication number	US-9433533-B2
Application number	US-97291008-A
Country	US
Kind code	B2
Filing date	Jan 11, 2008
Priority date	Jan 11, 2007
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

The present invention provides a patch package structure, which includes: a package including a first sheet material which is planar and a second sheet material which has been molded, the first and second sheet materials being sealed together in peripheral parts thereof, and a patch disposed in the package, in which the patch contains a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing, and a release liner which protects a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer; the second sheet material has been molded so as to have a protrudent part in at least a substantially central area thereof, the protrudent part having a planar outer shape larger than a planar outer shape of the release liner and having at least one recessed part; d is not smaller than T, in which d is the minimum gap distance between the inner surface of the first sheet material and the inner surface of the second sheet material at the recessed part and T is a thickness of the patch; and, at the boundary between the sealed part where the first and second sheet materials are sealed together and an unsealed part, the outer surface of the second sheet material rises at an obtuse angle.

First claim

What is claimed is:

1. A patch package structure, which comprises:
a package comprising a first sheet material which is planar and a second sheet material which has been molded, said first and second sheet materials being sealed together in peripheral parts thereof; and
a patch disposed in the package,
wherein the patch comprises a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing, and a release liner which protects a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer,
wherein the second sheet material has been molded so as to have a protrudent part in at least a substantially central area thereof, said protrudent part having a planar outer shape larger than a planar outer shape of the release liner and having at least one recessed part,
wherein d is equal to T, in which d is the minimum gap distance between the inner surface of the first sheet material and the inner surface of the second sheet material at the recessed part and T is a thickness of the patch, so as to reduce vertical movement of the patch inside the package,
wherein, at the boundary between the sealed part where the first and second sheet materials are sealed together and an unsealed part, the outer surface of the second sheet material rises at an obtuse angle,
wherein a maximum gap distance D between a package inner surface of the protrudent part of the second sheet material and the package inner surface of the first sheet material is larger than d and is smaller than 2.3×d, and
wherein the obtuse angle is in the range of 95 to 175 degrees.

2. The package structure according to claim 1 , wherein the release liner of the patch has a planar outer shape larger than a planar outer shape of the pressure-sensitive adhesive layer.

3. The package structure according to claim 1 ,
wherein the patch is disposed in the package in such a way that the release liner faces the inner surface of the first sheet material,
wherein the release liner has a cut line, and
wherein the recessed part of the second sheet material is positioned in such a way that the recessed part does not come into contact with a part of the backing which corresponds to the cut line.

4. The package structure according to claim 1 , wherein the protrudent part has two or more recessed parts.

5. The package structure according to claim 1 , wherein the pressure-sensitive adhesive layer contains a liquid component.

6. The package structure according to claim 1 , wherein the patch is an adhesive preparation comprising a pressure-sensitive adhesive layer containing a drug.

7. The package structure according to claim 1 , wherein the unsealed part is formed on a curved part which has a curved surface.

Assignees

• Okada Katsuhiro
• Iwao Yoshihiro
• Matsuoka Kensuke
• Nitto Denko Corp

Inventors

• Okada Katsuhiro
• Iwao Yoshihiro
• Matsuoka Kensuke

Classifications

• A61F15/001

  Packages or dispensers for bandages, cotton balls, drapes, dressings, gauze, gowns, sheets, sponges, swabsticks or towels (A61F15/007 takes precedence) · CPC title

• A61F13/0203 Primary

  with fluid retention members · CPC title

• A61F13/551

  Packaging before or after use {(general packaging of absorbent pads B65D85/00)} · CPC title

• B65D75/36

  one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages {, the recess or recesses being preformed (B65D73/0057, B65D73/0092 take precedence)} · CPC title

• B65D75/30 Primary

  Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding · CPC title