Edge plated printed circuit board

Patent metadata

Field	Value
Publication number	US-9433090-B2
Application number	US-201414224863-A
Country	US
Kind code	B2
Filing date	Mar 25, 2014
Priority date	Mar 25, 2014
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

An edge plated printed circuit board (PCB) improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical and electrical connection between the PCB and external EMI suppression components including an EMI chassis and gaskets. Inner ground layers within a multi-layer PCB are configured to physically extend to an edge of the PCB, which is plated using copper electroplating, so that copper ground strips disposed at the top and bottom surfaces of the PCB and the inner ground layers are all electrically coupled to the plated edge. In some embodiments, the ground strips can be made thinner compared to conventional arrangements, or be eliminated altogether as a result of the direct connection between the edge plated PCB and external EMI shields.

First claim

What is claimed:

1. A printed circuit board (PCB), comprising:
a dummy core having a circuit configuration of electrically conductive material on at least one of its surfaces;
one or more supplemental cores being layered with the dummy core so that the printed circuit board is multilayered; and
at least one plated edge to which one or more ground layers extend to form a continuous ground path, the ground layers being implemented using portions of one or more of the circuit configurations on the dummy core or on the one or more supplemental cores
wherein the plated edge is adapted to interface with an electromagnetic interference (EMI) gasket so that the ground path is electrically coupled to the EMI gasket, the interface being maintained along substantially the plated edge's entire length, and
wherein the EMI gasket is disposed in, and electrically coupled to an EMI chassis so that the ground path in the PCB is electrically coupled to the EMI chassis through the EMI gasket, and
wherein a first of the one or more supplemental cores includes a layer of conductive material on at least one of its surfaces adapted for carrying power in the PCB,
wherein a second of the one or more supplemental cores includes a layer of conductive material on at least one of its surfaces adapted for carrying signals in the PCB, and
wherein each of the layers of conductive materials in each of the first and second of the one or more supplemental cores does not extend, nor is electrically coupled, to the plated edge.

2. The PCB of claim 1 in which the dummy core's conductive material comprises copper foil.

3. The PCB of claim 1 in which the one or more of the supplemental cores' conductive material comprises copper foil.

4. The PCB of claim 1 further comprising a conductive strip disposed on a top or bottom surface of the PCB proximate to the plated edge.

5. The PCB of claim 4 in which the conductive strip is electrically coupled to the plated edged.

6. The PCB of claim 5 in which the conductive strip comprises a copper strip.

7. The PCB of claim 1 in which the plated edge is continuous along substantially the PCB's entire perimeter.

8. The PCB of claim 1 in which the plated edge comprises electroplated copper.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Atkinson Peter
• Fong Chee
• Casebolt Mark
• Liang Ying

Classifications

• H05K1/0298 Primary

  Multilayer circuits · CPC title

• H05K1/0215

  Grounding of printed circuits by connection to external grounding means · CPC title

• H05K2201/09354

  Ground conductor along edge of main surface · CPC title

• H05K9/0015

  Gaskets or seals · CPC title

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title