Printed wiring boards having thermal management features and thermal management apparatuses comprising the same

Patent metadata

Field	Value
Publication number	US-9433074-B2
Application number	US-201314038834-A
Country	US
Kind code	B2
Filing date	Sep 27, 2013
Priority date	Apr 29, 2013
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

A printed wiring board includes an insulator substrate, an electrical conductor at least partially embedded in the insulator substrate, and a thermal conductor at least partially embedded in the insulator substrate. The printed wiring board also includes a temperature-insensitive component mounting region and a temperature-sensitive component mounting region. The insulator substrate and the thermal conductor are arranged into a targeted heat transfer region proximate to the temperature-sensitive component mounting region and a bulk region at positions spaced apart from the temperature-sensitive component mounting region.

First claim

The invention claimed is:

1. A printed wiring board comprising:
an insulator substrate;
an electrical conductor at least partially embedded in the insulator substrate;
a thermal conductor at least partially embedded in the insulator substrate and electrically isolated from the electrical conductor;
a first mounting region; and
a second mounting region,
wherein the insulator substrate and the thermal conductor are arranged into:
a targeted heat transfer region proximate to the second mounting region, wherein the targeted heat transfer region comprises an arrangement of the thermal conductor that completely surrounds the second mounting region, and
a bulk region at positions spaced apart from the second mounting region, wherein the bulk region comprises a lattice arrangement of the thermal conductor in thermal continuity with the thermal conductor of the targeted heat transfer region.

2. The printed wiring board of claim 1 , further comprising an electronic component attachment module positioned proximate to the bulk region of the insulator substrate and the thermal conductor.

3. The printed wiring board of claim 1 , further comprising an electronic component attachment module positioned proximate to the targeted heat transfer region of the insulator substrate and the thermal conductor.

4. The printed wiring board of claim 1 , further comprising a heat sink positioned proximate to the bulk region of the insulator substrate and the thermal conductor.

5. The printed wiring board of claim 1 , wherein the targeted heat transfer region further comprises a composite structure having a plurality of thermally conductive rings that are embedded in the insulator substrate and encapsulate the second mounting region.

6. The printed wiring board of claim 1 , wherein the targeted heat transfer region comprises a composite structure having a plurality of thermally conductive spokes that are embedded in the insulator substrate and spiraled around the second mounting region.

7. The printed wiring board of claim 1 , wherein the targeted heat transfer region comprises a composite structure having a plurality of thermally conductive spokes that are embedded in the insulator substrate and radially arrayed around the second mounting region.

8. The printed wiring board of claim 1 , wherein an effective thermal conductivity of the targeted heat transfer region is within about 10% of the effective thermal conductivity of the bulk region.

9. A circuit board assembly comprising:
a printed wiring board comprising an insulator substrate, an electrical conductor at least partially embedded within the insulator substrate, a second mounting region in electrical continuity with the electrical conductor, a first mounting region in electrical continuity with the electrical conductor, and a thermal conductor at least partially embedded within the insulator substrate and electrically isolated from the electrical conductor;
a second component coupled to the second mounting region; and
a first component coupled to the first mounting region,
wherein the insulator substrate and the thermal conductor are arranged into:
a targeted heat transfer region proximate to the second mounting region, wherein the targeted heat transfer region comprises an arrangement of the thermal conductor that completely surrounds the first component, and
a bulk region at positions spaced apart from the second mounting region, wherein the bulk region comprises a lattice arrangement of the thermal conductor in thermal continuity with the thermal conductor of the targeted heat transfer region.

10. The circuit board assembly of claim 9 , wherein the electrical conductor is embedded within a first laminate and the thermal conductor is embedded within a second laminate, the first laminate and the second laminate coupled to one another in the printed wiring board.

11. The circuit board assembly of claim 9 , wherein the thermal conductor is arranged in a targeted heat transfer region proximate to the second mounting region, the targeted heat transfer region comprising a composite structure having a plurality of thermally conductive rings that are embedded in the insulator substrate and encapsulate the first component mounting region.

12. The circuit board assembly of claim 9 , wherein the thermal conductor is arranged in a targeted heat transfer region proximate to the second mounting region, the targeted heat transfer region comprising a composite structure having a plurality of thermally conductive spokes that are embedded in the insulator substrate and spiraled around the second mounting region.

13. The circuit board assembly of claim 9 , wherein the thermal conductor is arranged in a targeted heat transfer region proximate to the second mounting region, the targeted heat transfer region comprising a composite structure having a plurality of thermally conductive spokes that are embedded in the insulator substrate and radially arrayed around the first component mounting region.

14. A heat transfer management apparatus comprising:
a printed wiring board comprising an insulator substrate, an electrical conductor at least partially embedded in the insulator substrate, and a thermal conductor at least partially embedded in the insulator substrate and electrically isolated from the electrical conductor;
a first component coupled to the printed wiring board;
a second component coupled to the printed wiring board and positioned distally from the first component,
wherein the printed wiring board places the first component and the second component in thermal continuity with one another, and the thermal conductor and the insulator substrate are arranged into:
a targeted heat transfer region proximate to the first component, wherein the targeted heat transfer region comprises an arrangement of the thermal conductor that completely surrounds the first component, and
a bulk region proximate to the second component, wherein the bulk region comprises a lattice arrangement of the thermal conductor in thermal continuity with the thermal conductor of the targeted heat transfer region.

15. The heat transfer management apparatus of claim 14 , an effective thermal conductivity of the targeted heat transfer region is within about 10% of the effective thermal conductivity of the bulk region.

16. The heat transfer management apparatus of claim 14 , wherein the first component comprises a thermo-electric generator.

Assignees

• Toyota Motor Eng & Mfg North America Inc

Inventors

• Dede Ercan Mehmet
• Nomura Tsuyoshi
• Schmalenberg Paul
• Lee Jae Seung

Classifications

• H05K2201/09972

  Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently · CPC title

• H05K2201/0376

  Flush conductors, i.e. flush with the surface of the printed circuit · CPC title

• H05K2201/09718

  Clearance holes · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K2201/10553

  Component over metal, i.e. metal plate in between bottom of component and surface of PCB · CPC title