Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals

Patent metadata

Field	Value
Publication number	US-9432759-B2
Application number	US-201314065067-A
Country	US
Kind code	B2
Filing date	Oct 28, 2013
Priority date	Jul 22, 2013
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

First claim

What is claimed is:

1. A surface mountable microphone package comprising:
a first microphone;
a second microphone;
a first opening configured to receive sound waves to be recorded by the first microphone;
a second opening configured to receive sound waves to be recorded by the second microphone, the second opening being separate from the first opening;
a carrier, wherein the first microphone is mounted to a first surface of the carrier, and wherein the second microphone is mounted to a second surface of the carrier, the first and second surfaces being opposite to each other;
a first cover arranged on the first surface of the carrier and defining a first cavity housing for the first microphone, wherein the first opening is formed in the first cover; and
a second cover mounted to the second surface of the carrier and defining a second cavity housing for the second microphone, the second opening being formed in the second cover,
wherein the first and second microphones are arranged in a non-overlapping manner, wherein the first cavity is separated into a first chamber and into a second chamber, wherein the second cavity is separated into a third chamber and a fourth chamber, wherein the first microphone is arranged in the first chamber and in communication with the third chamber via an opening in the carrier, and wherein the second microphone is arranged in the fourth chamber and in communication with the second chamber via a further opening in the carrier.

2. The surface mountable microphone package of claim 1 , wherein the carrier comprises at least one of a substrate or a lead frame.

3. The surface mountable microphone package of claim 1 , wherein the first and second covers comprise at least one of a metal lid, a metal-coated resin, or a PCB structure including a frame portion and a cover portion.

4. A mobile phone comprising:
the surface mountable microphone package according to claim 1 ; and
an antenna.

Assignees

• Infineon Technologies Ag

Inventors

• Elian Klaus
• Theuss Horst
• Mueller Thomas

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H01L2924/15

  Electricity · mapped topic

• B81B7/0061

  suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title

• H04R19/005

  using semiconductor materials · CPC title