Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9431576B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9431576-B2 |
| Application number | US-201514791997-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 6, 2015 |
| Priority date | Sep 14, 2012 |
| Publication date | Aug 30, 2016 |
| Grant date | Aug 30, 2016 |
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A lighting device includes a plurality of light-emitting diodes including a first light-emitting diode with a non-rectangular shape in a top view, a submount to which each of the plurality of light-emitting diodes is coupled, and a plurality of conductive elements formed between the submount and the plurality of light-emitting diodes to electrically connecting at least a portion of the plurality of light-emitting diodes with each other in series.
Opening claim text (preview).
What is claimed is: 1. A lighting device, comprising: a plurality of light-emitting diodes including a first light-emitting diode with a non-rectangular shape in a top view; a submount to which each of the plurality of light-emitting diodes is coupled; and a plurality of conductive elements formed between the submount and the plurality of light-emitting diodes to electrically connecting at least a portion of the plurality of light-emitting diodes with each other in series. 2. The lighting device of claim 1 , wherein the non-rectangular shape comprises a diamond shape, a triangular shape, or a hexagonal shape. 3. The lighting device of claim 1 , further comprising a plurality of solder components formed between the submount and the plurality of light-emitting diodes. 4. The lighting device of claim 3 , wherein the plurality of light-emitting diodes comprises a second light-emitting diode having a bonding metal bonded to one of the solder components. 5. The lighting device of claim 1 , wherein the plurality of light-emitting diodes comprises a second light-emitting diode having an electrode, and a bonding metal formed on the electrode and having a width greater than that of the electrode in a cross-sectional view. 6. The lighting device of claim 1 , wherein the lighting device is free of using bonding wires. 7. The lighting device of claim 1 , further comprising a phosphor layer formed on the plurality of light-emitting diodes. 8. The lighting device of claim 1 , further comprising a growth substrate on which the plurality of light-emitting diodes is formed thereon. 9. The lighting device of claim 1 , wherein each of the plurality of light-emitting diodes has two electrodes formed on the same side thereof.
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