Wiring board and high frequency module using same

Patent metadata

Field	Value
Publication number	US-9431357-B2
Application number	US-201214123702-A
Country	US
Kind code	B2
Filing date	Aug 23, 2012
Priority date	Aug 23, 2011
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

A high frequency module wiring board includes a wiring section for high frequency transmission, and a solder resist layer formed upon the wiring section. The solder resist layer covers the wiring section so as to have an opening section at a part of the wiring section in a region extending within a predetermined distance from an input/output terminal of a chip component.

First claim

The invention claimed is:

1. A high frequency module wiring board, comprising:
a wiring section for high frequency transmission, the wiring section being arranged on the wiring board; and
a solder resist layer that is formed on and contacts the wiring section;
wherein the solder resist layer has an opening section at a part of the wiring section in a region extending within a predetermined distance from an input/output terminal of a surface mount type chip component mounted on the wiring board and the opening section of the solder resist layer is composed of a stripe-like pattern of solder resist so as to cover the wiring section at predetermined intervals.

2. The high frequency module wiring board according to claim 1 , wherein the opening section includes side surfaces of the wiring section.

3. The high frequency module wiring board according to claim 1 , wherein the opening section includes a plurality of openings and a width of the openings increases as a distance between a respective opening and the input/output terminal of the surface mount type chip component mounted on the wiring section increases.

4. A high frequency module wherein a high frequency module wiring board according to claim 1 is used; and
wherein the surface mount type chip component is connected to the wiring section through the input/output terminal.

5. A high frequency module wherein a high frequency module wiring board according to claim 1 is used; and
wherein the wiring section is used for microwave or millimeter-wave transmission.

6. The high frequency module wiring board according to claim 1 , wherein the opening section includes a plurality of openings formed at predetermined intervals in the solder resist layer.

7. The high frequency module wiring board according to claim 6 , wherein the opening section is formed along the wiring section excluding edge portions of the wiring section.

8. The high frequency module wiring board according to claim 6 , wherein the intervals in the opening section are not longer than λg/8 of a transmission frequency on the wiring section.

9. The high frequency module wiring board according to claim 6 , wherein the interval between adjacent openings of the plurality of openings decreases as a distance between the openings and the input/output terminal of the surface mount type chip component mounted on the wiring section increases.

Assignees

• Shiozaki Ryosuke
• Fujita Suguru
• Panasonic Corp

Inventors

• Shiozaki Ryosuke
• Fujita Suguru

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title