Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation

Patent metadata

Field	Value
Publication number	US-9431316-B2
Application number	US-77366910-A
Country	US
Kind code	B2
Filing date	May 4, 2010
Priority date	May 4, 2010
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

A semiconductor device has semiconductor die mounted to a temporary carrier. An encapsulant is deposited over the die and carrier. A channel is formed in a back surface of the die, either while in wafer form or after mounting to the carrier. The channel corresponds to a specific heat generating area of the die. The channel can be straight or curved or crossing pattern. The carrier is removed. An interconnect structure is formed over the encapsulant and die. The semiconductor die are singulated through the encapsulant. A TIM and heat sink are formed over the channel and encapsulant. Alternatively, a conformal plating layer can be formed over the channel and encapsulant. A conductive via can be formed through the encapsulant, and TSV formed through the die. The die with channels can be mounted over a second semiconductor die which is mounted to the interconnect structure.

First claim

What is claimed:

1. A method of making a semiconductor device, comprising:
providing a first semiconductor die including an active surface;
depositing an insulating material over a second surface of the semiconductor die opposite the active surface and around the first semiconductor die;
planarizing a surface of the insulating material to the second surface of the first semiconductor die;
forming a channel in the second surface of the first semiconductor die;
forming a conductive via through the insulating material around the first semiconductor die;
forming a heat sink extending into the channel and over the surface of the insulating material and contacting the conductive via; and
forming an interconnect structure over the insulating material and first semiconductor die and contacting the conductive via.

2. The method of claim 1 , further including singulating the first semiconductor die through the insulating material.

3. The method of claim 1 , further including forming the channel over a heat generating area of the first semiconductor die.

4. The method of claim 1 , further including forming a plurality of bumps between the first semiconductor die and interconnect structure.

Assignees

• Pagaila Reza Argenty
• Stats Chippac Pte Ltd

Inventors

• Pagaila Reza Argenty

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title