Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device
US9431314B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9431314-B2 |
| Application number | US-201113040079-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 3, 2011 |
| Priority date | Oct 21, 2010 |
| Publication date | Aug 30, 2016 |
| Grant date | Aug 30, 2016 |
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Abstract
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A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.
First claim
Opening claim text (preview).
What is claimed is: 1. A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 150 nm and no greater than 500 nm; wherein: said thermosetting resin and said flux agent are separate ingredients, said thermosetting resin composition is in the form of a film, said thermosetting resin contains an epoxy resin which is solid at 25° C. wherein the inorganic filler with a mean particle size of no greater than 100 nm is surface-treated, and wherein the inorganic filler with a mean particle size of greater than 150 nm and no greater than 500 nm is non-surface-treated. 2. A thermosetting resin composition for an underfilling of a semiconductor according to claim 1 , wherein the viscosity at 250° C. is no greater than 100 Pa·s. 3. A thermosetting resin composition for an underfilling of a semiconductor according to claim 1 , which has a transmittance of at least 10% for light with a wavelength of 555 nm. 4. A semiconductor device produced using a thermosetting resin composition for an underfilling of a semiconductor according to claim 1 . 5. The thermosetting resin composition for an underfilling of a semiconductor according to claim 1 , wherein the content of the inorganic filler with a mean particle size of no greater than 100 nm is 10-90 wt % of the total inorganic filler. 6. The thermosetting resin composition for an underfilling of a semiconductor according to claim 1 , wherein the inorganic fillers are selected from the group consisting of silica, alumina, mullite, silicon and titanium complex oxide, and boron nitride. 7. The thermosetting resin composition for an underfilling of a semiconductor according to claim 1 , wherein the flux agent is selected from the group consisting of alcohols, phenols and carboxylic acids.
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Classifications
on active surfaces of flip-chip devices, e.g. underfills · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title
characterised by their materials · CPC title
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- What does patent US9431314B2 cover?
- A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of gr…
- Who is the assignee on this patent?
- Enomoto Tetsuya, Miyazawa Emi, Honda Kazutaka, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10W74/473. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 30 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).