Wafer-scale package including power source

Patent metadata

Field	Value
Publication number	US-9431312-B2
Application number	US-201615079957-A
Country	US
Kind code	B2
Filing date	Mar 24, 2016
Priority date	Oct 26, 2010
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.

First claim

The invention claimed is:

1. A method comprising:
connecting a control module to one of a first substrate and a second substrate, wherein the first substrate includes at least one of a first semiconductor material and a first insulating material, wherein the second substrate includes at least one of a second semiconductor material and a second insulating material, and wherein the control module is configured to one of determine a physiological parameter of a patient and deliver electrical therapy to the patient;
connecting an energy storage device to one of the first and second substrates;
interfacing the first and second substrates such that the first and second substrates define an enclosed cavity between the first and second substrates, the enclosed cavity including the control module and the energy storage device; and
heating an interface between the first and second substrates to form a bond between the first and second substrates.

2. The method of claim 1 , wherein heating the interface includes heating at least a portion of the interface using a laser directed at the interface.

3. The method of claim 1 , wherein the first substrate includes a glass substrate, the second substrate includes a glass substrate, and one of the first and second substrates includes a light absorbing layer at the interface.

4. The method of claim 3 , wherein the light absorbing layer absorbs light at a wavelength that is transmitted by one of the first and second substrates.

5. The method of claim 3 , wherein heating the interface includes heating at least a portion of the light absorbing layer using a laser directed at the light absorbing layer.

6. The method of claim 1 , wherein the first substrate includes a glass substrate and the second substrate includes a semiconductor substrate.

Assignees

• Medtronic Inc

Inventors

• O'Brien Richard J
• Day John K
• Gerrish Paul F
• Mattes Michael F
• Ruben David A
• Grief Malcolm K

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title