Integrated LED-based luminaire for general lighting

Patent metadata

Field	Value
Publication number	US-9429279-B2
Application number	US-201313757919-A
Country	US
Kind code	B2
Filing date	Feb 4, 2013
Priority date	Oct 9, 2007
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

Lighting apparatus and methods employing LED light sources are described. The LED light sources are integrated with other components in the form of a luminaire or other general purpose lighting structure. Some of the lighting structures are formed as Parabolic Aluminum Reflector (PAR) luminaires, allowing them to be inserted into conventional sockets. The lighting structures display beneficial operating characteristics, such as efficient operation, high thermal dissipation, high output, and good color mixing.

First claim

The invention claimed is:

1. An illumination apparatus, comprising:
an LED module having at least a first die and a second die, the first die configured to produce a first spectrum of radiation and the second die configured to produce a second spectrum of radiation;
the LED module having a primary substantially dome shaped lens with a first texturing;
a parabolic secondary reflector optic having a first opening with a first diameter and a second opening with a second diameter, the first diameter less than the second diameter;
the primary substantially dome shaped lens positioned adjacent the first opening;
the secondary reflector optic having a second texturing on at least a portion of a light receiving surface of the secondary reflector optic;
a temperature sensor adjacent to the LED module;
a power converter providing power factor correction and operating voltage to the LED module, the power converter being a switching power supply which receives input from the temperature sensor to control a first current to the first die and a second current to the second die.

2. The apparatus of claim 1 , wherein the primary lens comprises a hemispherical lens raised a distance (H 1 ) above a substrate to which the first and second die are coupled.

3. The apparatus of claim 1 , wherein the secondary reflector optic forms an exit aperture through which light produced by the LED module passes, and wherein there is no diffusing element across the exit aperture.

4. The apparatus of claim 1 , further comprising a heat sink to which the LED-based light source is thermally coupled, and a thermal connector mounted in or on the heat sink.

5. The apparatus of claim 1 , wherein the secondary reflector optic has an exit aperture, and wherein the apparatus further comprises a diffuser disposed across the exit aperture.

6. The apparatus of claim 4 , further comprising an element mechanically coupled to the heat sink and having a cavity therein for receiving power circuitry for providing power to the LED module, the element configured to mate to a screw base.

7. The apparatus of claim 4 , further comprising a housing formed of electrically non-conducting material, and wherein the LED module, the secondary optic, and the heat sink are disposed within the housing.

8. The apparatus of claim 4 , wherein the thermal connector is a copper plug.

9. The apparatus of claim 6 , further comprising the power circuitry, and a flexible circuit interconnecting the LED module and the power circuitry.

10. The apparatus of claim 7 , wherein the housing defines one or more holes configured to facilitate heat dissipation.

11. The apparatus of claim 8 , wherein the copper plug has a first surface raised above the heat sink, and wherein the LED module is mounted on the first surface of the copper plug.

12. The apparatus of claim 10 , further comprising a cover lens coupled to the housing, wherein the cover lens and housing in combination substantially surround the LED module, the secondary reflector optic, and the heat sink.

13. The apparatus of claim 11 , wherein the temperature sensor is mounted within or proximate to the heat sink and thermally coupled to the LED module.

Assignees

• Koninl Philips Electronics Nv
• Philips Solid-State Lighting Solutions Inc

Inventors

• Dowling Kevin J
• Lys Ihor A
• Williamson Ryan C
• Roberge Brian
• Roberts Ron
• Morgan Frederick
• Datta Michael Jay
• Mollnow Tomas Jonathan

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• F21K9/60 Primary

  Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction · CPC title

• Y02B20/347

  Cross-Sectional Technologies · mapped topic

• H05B33/0857

  Electricity · mapped topic

• F21K9/50 Primary

  Mechanical Engineering · mapped topic