Adhesive dispensing system and method using smart melt heater control
US-9200741-B2 · Dec 1, 2015 · US
US9427768B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9427768-B2 |
| Application number | US-201313790118-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 8, 2013 |
| Priority date | Oct 26, 2012 |
| Publication date | Aug 30, 2016 |
| Grant date | Aug 30, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An adhesive dispensing system and method are configured to melt adhesive on demand and maintain the adhesive in a liquid state between dispensing cycles. The dispensing system includes a dispensing applicator with a manifold passage, a receiving device including a receiving chamber for holding a small amount of solid adhesive at the dispensing applicator and a first heating device for melting the adhesive on demand, and a second heating device at the manifold to maintain the temperature of the melted adhesive before dispensing. The receiving device is positioned adjacent to or partially nested within a manifold of the dispensing applicator such that the melted adhesive is delivered directly into the dispensing applicator. The second heating device applies heat energy to maintain the adhesive in the manifold passage as a liquid.
Opening claim text (preview).
What is claimed is: 1. An adhesive dispensing system, comprising: a dispensing applicator for dispensing an adhesive, said dispensing applicator including a manifold with a manifold passage and a dispensing module coupled to said manifold passage; a receiving device positioned proximate to said dispensing applicator, said receiving device including a receiving chamber, which is configured to receive a small amount of solid adhesive at the location of said dispensing applicator,…
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Related publications grouped by family.
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Answers are generated from the same data shown on this page.