Film insert molding for device manufacture

Patent metadata

Field	Value
Publication number	US-9426914-B2
Application number	US-201213997871-A
Country	US
Kind code	B2
Filing date	May 17, 2012
Priority date	May 17, 2012
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.

First claim

We claim:

1. A method of constructing a device comprising:
forming a film into a shape that defines an interior region;
disposing an electronic component within the interior region of the film;
incorporating an additive into a thermo-set resin, wherein the additive is configured to absorb, store and distribute heat generated by the electronic component during operation of the device, and wherein the resin includes a castable material;
substantially filling the interior region of the film with the thermo-set resin, wherein the thermo-set resin encompasses the electronic component; and
hardening the thermo-set resin.

2. The method of claim 1 , further including coupling content to a surface of the film prior to forming the film.

3. The method of claim 2 , wherein the content is coupled to one or more of an interior surface and an exterior surface of the film.

4. The method of claim 2 , wherein the content is one or more of printed onto and drawn into the surface of the film.

5. The method of claim 1 , wherein the thermo-set resin is hardened at a temperature below approximately sixty degrees Celsius.

6. The method of claim 1 , wherein forming the film includes:
disposing the film within a mold;
using the mold to provide the film with the shape that defines the interior region; and
trimming the film.

7. The method of claim 6 , further including using the film as a release layer to remove the device from the mold.

8. The method of claim 1 , wherein forming the film includes forming a film having one or more of a plastic material, a metal material, and a flame retardant material.

9. The method of claim 1 , wherein the device is a computing device and disposing the electrical component within the interior region of the film includes disposing a circuit board having one or more of a processor, a memory controller, a memory module, and a chipset component within the interior region.

Assignees

• Davison Peter
• Pidwerbecki David
• Intel Corp

Inventors

• Davison Peter
• Pidwerbecki David

Classifications

• G06F1/32

  Means for saving power · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K7/02 Primary

  Arrangements of circuit components or wiring on supporting structure · CPC title

• G06F1/1626 Primary

  with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title

• B29C39/10

  incorporating preformed parts or layers, e.g. casting around inserts or for coating articles {(coating a surface by casting in general B05D1/30, B29C39/126 takes precedence)} · CPC title