LED device, method of manufacturing the same, and light-emitting apparatus

Patent metadata

Field	Value
Publication number	US-9425372-B2
Application number	US-201113521294-A
Country	US
Kind code	B2
Filing date	Jan 18, 2011
Priority date	Jan 29, 2010
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

The LED device ( 27 ) has a LED bare chip ( 25 ) mounted directly on a metal contact ( 28 ), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.

First claim

The invention claimed is:

1. An LED device to be connected to a socket connector, comprising:
a device body made of plastic and having a first surface and a second surface opposite to the first surface;
a plurality of metal contacts insert-molded in the device body and each having a first end portion placed on the first surface and a second end portion opposite to the first end portion; and
a plurality of LED bare chips mounted directly on the first end portions of the metal contacts, respectively,
wherein the second end portions of the metal contacts protrude outward of the device body from the second surface, thereby forming terminal portions each of which has a plate shape perpendicular to the second surface,
wherein each of the terminal portions extends lengthily along the second surface to fit snugly with an elongated socket of the socket connector, and
wherein power supply to the LED bare chips and heat radiation from the LED bare chips are carried out through the metal contacts.

2. The LED device according to claim 1 , wherein the LED bare chips are provided, in equal number, on the metal contacts.

3. A method of manufacturing the LED device according to claim 1 , the method comprising steps of:
preparing a lead frame formed with a pair of metal contacts,
forming a device body by insert-molding the pair of metal contacts with the plastic, the device body having a first surface and a second surface opposite to the first surface, the metal contacts having a first end portion on the first surface and a second end portion opposite to the first end portion, the second end portion protruding outward from the second surface to provide a terminal portion, the terminal portion being adapted to be inserted into a socket connector,
mounting the LED bare chip on the pair of metal contacts to form the LED device on the lead frame, and
then cutting the metal contacts to separate the LED device from the lead frame.

4. A light-emitting apparatus comprising:
the LED device according to claim 1 ; and
a connector formed to fit the metal contacts included in the LED device,
wherein, when the connector is fitted to the metal contact, power is supplied to the LED bare chip through the connector and the metal contacts and heat of the LED bare chip is transmitted through the metal contacts and the connector to carry out heat dissipation.

5. The light-emitting apparatus according to claim 4 , further comprising:
an attaching object to which the connector is attached, and
a plurality of interconnections formed on a surface of the attaching object,
wherein the connector is disposed in a bridging state between the interconnections, and the metal contacts are connected to the interconnections.

6. The light-emitting apparatus according to claim 4 , further comprising:
an attaching object to which the connector is attached, and
a plurality of metal plates which are disposed adjacent to each other and are electrically independent of each other,
wherein the connector is disposed in a bridging state between the adjacent metal plates and the metal contacts are connected to the metal plates.

7. The light-emitting apparatus according to claim 6 , wherein the plurality of metal plates are arranged parallel to each other.

8. The light-emitting apparatus according to claim 6 , wherein the plurality of metal plates are arranged in a circumferential direction.

9. The light-emitting apparatus according to claim 6 , wherein the plurality of metal plates are arranged in a radial direction.

10. The light-emitting apparatus according to claim 5 , further comprising a separate component that fixes the connector to the attaching object.

11. The light-emitting apparatus according to claim 10 , wherein the separate component is insulating.

12. The light-emitting apparatus according to claim 6 , further comprising a separate component that fixes the connector to the attaching object.

13. The light-emitting apparatus according to claim 12 , wherein the separate component is insulating.

14. The LED device according to claim 1 , further comprising a plurality of conductive wires electrically connecting the metal contacts to the LED bare chips mounted on the metal contacts, respectively.

15. The LED device according to claim 14 , further comprising an additional conductive wire, wherein the metal contacts are two, the LED bare chips being two and electrically connected to each other by the additional conductive wire.

16. The LED device according to claim 14 , further comprising two additional conductive wires, wherein. the LED bare chips are four, the additional conductive wires each electrically connecting between. the LED bare chips mounted on different ones of the metal contacts.

17. The LED device according to claim 14 , further comprising an additional conductive wire, wherein the metal contacts are two, the LED bare chip mounted on one of the metal contacts being electrically connected to another of the metal contacts by the additional conductive wire.

Assignees

• Kanno Hideyuki
• Japan Aviation Electronics Ind Ltd

Inventors

• Kanno Hideyuki

Classifications

• H05K2201/10189

  Non-printed connector · CPC title

• F21Y2105/10

  comprising a two-dimensional [2D] array of point-like light-generating elements · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• F21Y2103/33

  annular · CPC title

• H05K2201/1031

  Surface mounted metallic connector elements · CPC title