Chip packages and methods of manufacture thereof

Patent metadata

Field	Value
Publication number	US-9425179-B2
Application number	US-201414472785-A
Country	US
Kind code	B2
Filing date	Aug 29, 2014
Priority date	Aug 29, 2014
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

Chip packages and methods of manufacture thereof are described. In an embodiment, a method for manufacturing a chip package may include: providing a support structure including: a base; and a stage pivotably attached to the base, the stage having a surface facing away from the base; attaching a first die having at least one second die disposed thereon to the surface of the stage; pivotably tilting the stage; and after the pivotably tilting, dispensing an underfill over the first die and adjacent to the least one second die, the underfill flowing through a first standoff gap disposed between the first die and the at least one second die.

First claim

What is claimed is:

1. A method comprising:
providing a support structure having a chip stack attached to an inclined surface of the support structure, the chip stack comprising:
a substrate;
a first integrated circuit die, the first integrated circuit die having contact pads on a top major surface thereof and on a bottom major surface thereof, the contact pads on the bottom major surface of the first integrated circuit die being mounted to the substrate by connectors;
a first underfill material encapsulating the connectors;
at least one second die disposed over the first integrated circuit die, a first second die of the at least one second die being mounted on the first integrated circuit die and electrically connected to the contact pads on the top major surface of the first integrated circuit die by second connectors; and
a first standoff gap between the first integrated circuit die and the at least one second die, wherein the at least one second die has a first sidewall and a second sidewall opposite the first sidewall, the first sidewall disposed higher on the inclined surface of the support structure than the second sidewall; and

dispensing a second underfill over the first integrated circuit die and adjacent to the first sidewall of the at least one second die, the second underfill flowing through the first standoff gap from the first sidewall to the second sidewall of the at least one second die.

2. The method of claim 1 , wherein the dispensing the second underfill over the first sidewall of the at least one second die comprises a jetting process.

3. The method of claim 1 , wherein the providing the support structure having the chip stack attached to the inclined surface of the support structure comprises:
placing the chip stack on the inclined surface of the support structure; and
securing the chip stack to the inclined surface of the support structure by a suction force delivered through the support structure.

4. The method of claim 3 , wherein the placing the chip stack on the inclined surface of the support structure comprises:
determining an incline angle for the inclined surface of the support structure;
pivotably tilting a portion of the support structure based on the incline angle to form the inclined surface of the support structure; and
disposing the chip stack on the inclined surface of the support structure.

5. The method of claim 4 , wherein the pivotably tilting the portion of the support structure based on the incline angle to form the inclined surface of the support structure comprises exerting a repulsion force or an attraction force on a distal end of the portion of the support structure.

6. The method of claim 5 , wherein the exerting the repulsion force or the attraction force on the distal end of the portion of the support structure comprises generating a magnetic field to exert the repulsion force or the attraction force on the distal end of the portion of the support structure.

7. The method of claim 1 , wherein the providing the support structure having the chip stack attached to the inclined surface of the support structure comprises:
attaching the chip stack to a surface of the support structure; and
pivotably tilting the surface of the support structure to form the inclined surface of the support structure having the chip stack attached thereto.

8. The method of claim 7 , wherein the attaching the chip stack to the surface of the support structure comprises:
placing the chip stack on the surface of the support structure; and
securing the chip stack to the surface of the support structure by a suction force delivered through the support structure.

9. The method of claim 1 , wherein the providing the support structure having the chip stack attached to the inclined surface of the support structure comprises providing the support structure having the substrate of the chip stack attached to the inclined surface of the support structure.

10. The method of claim 1 , wherein the at least one second die comprises a plurality of vertically stacked second dies having a second standoff gap between each of the plurality of vertically stacked second dies, and wherein the dispensing further comprises dispensing the second underfill at a side of the second standoff gaps, the second underfill flowing through the second standoff gaps.

11. The method of claim 1 , further comprising:
after the dispensing, heating the second underfill by providing thermal energy to the second underfill through the support structure.

12. A method comprising:
providing a support structure comprising:
a base; and
a stage pivotably attached to the base, the stage having a surface facing away from the base;

attaching a first die having at least one second die disposed thereon to the surface of the stage;
generating a magnetic field to pivotably tilt the stage; and
after the pivotably tilting, dispensing an underfill over the first die and adjacent to the at least one second die, the underfill flowing through a first standoff gap disposed between the first die and the at least one second die.

13. The method of claim 12 , wherein the pivotably tilting the surface of the stage comprises exerting a repulsion force or an attraction force on a lateral portion of the stage.

14. The method of claim 12 , wherein the attaching the first die having at least one second die disposed thereon to the surface of the stage comprises:
placing the first die on the surface of the stage; and
securing the first die to the surface of the stage by a suction force delivered to the surface of the stage.

15. The method of claim 12 , wherein generating the magnetic field comprises generating the magnetic field at a lateral portion of the base using a magnet located over the base and below the stage.

16. The method of claim 12 , further comprising dampening the tilting of the stage while pivotably tilting the stage.

17. A method, comprising:
placing a chip stack on a support structure comprising a base, a stage pivotably attached to the base, and resilient structures attached between lateral portions of the base and lateral portions of the stage;
pivotably tilting the stage of the support structure to form an inclined stage, the resilient structures dampening the tilting of the stage; and
dispensing an underfill over a portion of the chip stack.

18. The method of claim 17 , wherein the chip stack comprises a substrate, a first die over the substrate, and at least one second die over the first die, and wherein the dispensing the underfill comprises jetting the underfill over the first die and laterally adjacent to the at least one second die, the underfill flowing through a standoff gap between the first die and the at least one second die.

19. The method of claim 17 , wherein the pivotably tilting the stage of the support structure comprises generating a magnetic field to pivotably tilt the stage.

20. The method of claim 17 , wherein the pivotably tilting the stage of the support structure comprises pre-determining an incline angle for the inclined stage and pivotably tilting the stage based on the pre-determined incline angle.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hwang Chien Ling
• Lee Pei-Hsuan
• Huang Ying-Jui
• Lin Yeong-Jyh
• Liu Chung-Shi

Classifications

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title