Light emitter array

Patent metadata

Field	Value
Publication number	US-9425172-B2
Application number	US-28895708-A
Country	US
Kind code	B2
Filing date	Oct 24, 2008
Priority date	Oct 24, 2008
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

Lamps, luminaries or solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. The discrete light sources are arranged in an array pursuant to certain guidelines to promote mixing of light from light sources emitting different colors of light. One embodiment solid state lighting component comprises a light emitting diode (LED) component having an array of LED chips having a first group of LED chips and one or more additional groups of LED chips. The array is arranged so that no two LED chips from said first group are directly next to one another in the array, that less than fifty percent (50%) of the LED chips in the first group of LEDs is on the perimeter of the array, and at least three LED chips from the one or more additional groups is adjacent each of the LED chips in the first group.

First claim

We claim:

1. A light emitting diode (LED) component, comprising:
an array of LEDs comprising groups of first, second, and third LEDs, wherein no two of the first group LEDs are directly next to one another in said array;
wherein less than fifty percent (50%) of the LEDs in said first group of LEDs are on the perimeter of said array; and
a lens over at least a portion of said array, said lens at least partially surrounding said array on at least two sides;
wherein each of said first, second, and third groups of LEDs are connected in respective serial strings.

2. The LED component of claim 1 , wherein said first group of LEDs comprises red emitting LEDs.

3. The LED component of claim 1 , wherein said second group of LEDs comprises blue shifted yellow (BSY) LEDs.

4. The LED component of claim 1 , wherein said LEDs are mounted on a submount.

5. The LED component of claim 4 , further comprising die attach pads, conductive traces and contact pads on the top surface of said submount.

6. The LED component of claim 5 , wherein said conductive traces connect said first and second groups of LEDs in respective serial strings.

7. The LED component of claim 5 , wherein said contact pads are at the edge of said submount and along one side of said submount.

8. The LED component of claim 1 , further comprising two electrostatic discharge (ESD) protection devices, each of which is mounted to a respective one of said strings to protect said LEDs on said strings from ESD damage.

9. The LED component of claim 1 , wherein said second and third groups of LEDs comprise blue-shifted yellow (BSY) LEDs of different BSY hues.

10. The LED component of claim 1 , where said first group of LEDs comprises at least one LED emitting light having a wavelength in the range of 600 nm to 640 nm.

11. The LED component of claim 1 , wherein said second group of LEDs comprises at least one LED emitting light having x, y color coordinates which define a point which is within an area on a 1931 CIE Chromaticity Diagram enclosed by first, second, third, fourth and fifth line segments, the first line segment connecting a first point to a second point, the second line segment connecting the second point to a third point, the third line segment connecting the third point to a fourth point, the fourth line segment connecting the fourth point to a fifth point, and the fifth line segment connecting the fifth point to the first point, the first point having x, y coordinates of 0.32, 0.40, the second point having x, y coordinates of 0.36, 0.48, the third point having x, y coordinates of 0.43, 0.45, the fourth point having x, y coordinates of 0.42, 0.42, and the fifth point having x, y coordinates of 0.36, 0.38.

12. The LED component of claim 1 , wherein third group of LEDs comprises at least one LED emitting light having x, y color coordinates which define a point which is within an area on a 1931 CIE Chromaticity Diagram enclosed by first, second, third, fourth and fifth line segments, the first line segment connecting a first point to a second point, the second line segment connecting the second point to a third point, the third line segment connecting the third point to a fourth point, the fourth line segment connecting the fourth point to a fifth point, and the fifth line segment connecting the fifth point to the first point, the first point having x, y coordinates of 0.32, 0.40, the second point having x, y coordinates of 0.36, 0.48, the third point having x, y coordinates of 0.43, 0.45, the fourth point having x, y coordinates of 0.42, 0.42, and the fifth point having x, y coordinates of 0.36, 0.38.

13. The LED component of claim 1 , wherein said lens comprises a molded lens.

14. The LED component of claim 1 , wherein said lens is molded prior to being placed over said at least a portion of said array.

15. The LED component of claim 1 , wherein no two of the first group LEDs have surfaces overlapping at 50% or greater.

16. The LED component of claim 1 , wherein no two of the first group of LEDs have surfaces facing each other.

17. The LED component of claim 1 , wherein a closest point between two of the first group of LEDs are between corners of said two of the first group of LEDs.

18. A light emitting diode (LED) component, comprising:
an array of LEDs on a submount, said array of LEDs comprising a first group of LEDs and one or more additional groups of LEDs, wherein at least three LEDs from said one or more additional groups are adjacent to each of said LEDs in said first group, wherein said first group of LEDs and each of said one or more additional groups of LEDs are connected in respective serial strings,
wherein less than fifty percent (50%) of the LEDs in said first group of LEDs are on the perimeter of said array;
a lens over at least a portion of the array;
wherein said one or more additional groups of LEDs comprise blue shifted yellow (BSY) or blue shifted green (BSG) LEDs.

19. The LED component of claim 18 , wherein said first group of LEDs comprise red emitting LEDs.

20. The LED component of claim 18 , wherein said one or more additional groups of LEDs comprises first and second groups of (BSY) BSY LEDs.

21. The LED component of claim 18 , wherein said LEDs are mounted on a submount.

22. The LED component of claim 18 , further comprising a protective layer at least partially covering a surface of said submount.

23. The LED component of claim 22 , wherein different electrical signals can be applied to each of said series strings.

24. The LED component of claim 18 , further comprising a plurality of ESD protection devices, each of which is mounted to a respective one of said strings to protect said LEDs on said strings from ESD damage.

25. The LED component of claim 18 , wherein said lens is molded prior to being placed over said at least a portion of said array.

26. The LED component of claim 18 , wherein no two LEDs of the first group of LEDs that are directly next to each other have parallel side surfaces facing each other that overlap in a planar direction by 50% or greater.

27. The LED component of claim 18 , wherein no two of the first group of LEDs have surfaces facing each other.

28. The LED component of claim 18 , wherein a closest point between two of the first group of LEDs are between corners of said two of the first group of LEDs.

29. The LED component of claim 18 , wherein said lens and said protective layer are comprised of the same material.

30. A light emitting diode (LED) component, comprising:
an array of LEDs mounted on a submount, said array of LEDs comprising a first group of LEDs and one or more additional groups of LEDs, wherein less than fifty percent (50%) of the LEDs in said first group of LEDs is on the perimeter of said array;
wherein each of said first group of LEDs and one or more additional groups of LED are connected in respective serial strings.

31. The LED component of claim 30 , further comprising a submount and a lens, wherein said LEDs are mounted to said submount and said lens is over at least a portion of the said LEDs.

32. The LED component of claim 31 , wherein said lens and said protective layer are comprised of the same material.

33. The LED component of claim 30 , wherein said first group of LEDs comprise red emitting LEDs.

34.

Assignees

• Van De Ven Antony P
• Negley Gerald
• Cree Inc

Inventors

• Van De Ven Antony P
• Negley Gerald

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00 Primary

  Package configurations · CPC title