Common mode filter and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9424988-B2
Application number	US-201514729677-A
Country	US
Kind code	B2
Filing date	Jun 3, 2015
Priority date	Dec 30, 2011
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.

First claim

What is claimed is:

1. A method of manufacturing a common mode filter comprising:
preparing a lower substrate, an upper substrate, and an insulating layer having a conductor pattern inside;
laminating the lower substrate, the upper substrate, and the insulating layer;
forming a hole penetrating the insulating layer and the lower substrate or the upper substrate; and
forming a ferrite core made of ferrite in the hole.

2. The method of manufacturing a common mode filter according to claim 1 , wherein forming the hole is performed by a routing process.

3. The method of manufacturing a common mode filter according to claim 1 , wherein forming the ferrite core comprises:
filling slurry made of ferrite in the hole; and
curing the slurry.

4. The method of manufacturing a common mode filter according to claim 3 , wherein the slurry is formed by mixing ferrite powder and a resin consisting of at least one material or a mixture of at least two materials selected from epoxy, polyimide, and polyamide.

5. The method of manufacturing a common mode filter according to claim 4 , wherein the slurry is formed by further mixing additive powder made of at least one material or a mixture of at least two materials selected from a copper oxide, a nickel oxide, and a zinc oxide.

6. The method of manufacturing a common mode filter according to claim 4 , wherein the ferrite powder or the additive powder is balled and the powder particles are mixed by being uniformly dispersed through a 3-roll-miller.

7. The method of manufacturing a common mode filter according to claim 4 , wherein a weight ratio of the ferrite powder and the resin is 8:2 to 9:1.

8. The method of manufacturing a common mode filter according to claim 3 , wherein filling the slurry is performed by a screen printing method or a die coating method.

9. The method of manufacturing a common mode filter according to claim 3 , wherein the slurry has different particle sizes.

10. The method of manufacturing a common mode filter according to claim 2 , wherein the slurry consists of granulated particles with a particle size of 2 to 3 μm and minute particles with a particle size of 0.3 to 0.5 μm.

11. The method of manufacturing a common mode filter according to claim 3 , wherein filling the slurry separately fills the slurry with different particle sizes.

12. The method of manufacturing a common mode filter according to claim 11 , wherein the slurry with a particle size of 2 to 3 μm is primarily filled and the slurry with a particle size of 0.3 to 0.5 μm is secondarily filled.

13. The method of manufacturing a common mode filter according to claim 3 , wherein a vacuum deaeration process for removing air bubbles included in the slurry is performed before curing the slurry.

14. The method of manufacturing a common mode filter according to claim 3 , wherein curing the slurry raises a temperature at 1° C./min in a low temperature region and raises a temperature at 5° C./min in a high temperature region.

15. The method of manufacturing a common mode filter according to claim 1 , wherein in laminating, a bonding layer is further laminated between the lower substrate and the insulating layer and/or between the upper substrate and the insulating layer to bond the lower substrate, the upper substrate, and the insulating layer.

16. The method of manufacturing a common mode filter according to claim 15 , wherein the bonding layer is formed by mixing ferrite powder and a resin consisting of at least one material or a mixture of at least two materials selected from epoxy, polyimide, and polyamide.

17. The method of manufacturing a common mode filter according to claim 1 , wherein the lower substrate and the upper substrate are made of ferrite.

18. The method of manufacturing a common mode filter according to claim 1 , wherein the insulating layer is made of at least one material or a mixture of at least two materials selected from epoxy, polyimide, and polyamide.

19. The method of manufacturing a common mode filter according to claim 1 , wherein the insulating layer is formed by mixing at least one material of B 2 O3-SiO 2 glass and Al 2 O 3 —SiO 2 glass and at least one low temperature fired ceramic powder of SiO 2 , B 2 O 3 , Al 2 O 3 , Li 2 O, MgO, CaO, SrO, and ZnO.

Assignees

• Samsung Electro Mech

Inventors

• Kim Yong Suk
• Wi Sung Kwon
• Kwak Jeong Bok
• Lee Sang Moon
• Sim Won Chul
• Yoo Young Seuck

Classifications

• H01F41/0206 Primary

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• B32B2037/243

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• B32B2038/047

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