Thin film coil, shield part including the same, and contactless power transmission device having the shield part

US9424983B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9424983-B2
Application numberUS-201313895608-A
CountryUS
Kind codeB2
Filing dateMay 16, 2013
Priority dateMar 13, 2013
Publication dateAug 23, 2016
Grant dateAug 23, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a thin film coil, including a thin type coil pattern, and a coil lead-out portion including a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line.

First claim

Opening claim text (preview).

What is claimed is: 1. A thin film coil, comprising: a thin type coil pattern; and a coil lead-out portion including a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof, and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line. 2. The thin film coil of claim 1 , further comprising an insulation layer formed between the coil pattern and the lead-out line. 3. The thin film coil of claim 1 , wherein the conductive adhesive layer is at least one selected from a group consisting of an anisotropic conductive film, a conductive polymer and a conductive metal. 4. The thin film coil of claim 1 , wherein a thickness of the conductive adhesive layer is 5 to 30 μm. 5. The thin film coil of claim 1 , wherein a thickness of the coil pattern is 5 to 95 μm. 6. A shield part, comprising: at least one or more magnetic sheets stacked on one another; a coil pattern formed on the magnetic sheets, at least one of the magnetic sheets having a groove formed in one surface or a through hole formed therein; and a coil lead-out portion embedded in the groove or through hole of the magnetic sheet, wherein the coil lead-out portion includes a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof, and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line. 7. The shield part of claim 6 , wherein the magnetic sheets include first to n th magnetic sheets layered from top to bottom, and the first magnetic sheet has the groove or through hole formed therein. 8. The shield part of claim 6 , wherein the magnetic sheets include first to n th magnetic sheets layered from top to bottom, conductive vias in the first to (n−1) th magnetic sheets are filled with conductive material, the conductive vias electrically connect the central portion of the coil pattern to the conductive adhesive layer, and the n th magnetic sheet has the groove or though hole formed therein. 9. The shield part of claim 6 , wherein the magnetic sheets include first to n th magnetic sheets layered from top to bottom, conductive vias in the first to (m−1) th magnetic sheets (m<n) are filled with conductive material, the conductive vias electrically connect the central portion of the coil pattern to the conductive adhesive layer, and the m th magnetic sheet has the groove or though hole formed therein. 10. The shield part of claim 6 , wherein the conductive adhesive layer is at least one selected from a group consisting of an anisotropic conductive film, a conductive polymer and a conductive metal. 11. The shield part of claim 6 , wherein a thickness of the conductive adhesive layer is 5 to 30 μm. 12. A contactless power transmission device, comprising: a shield part; a lead-out pad electrically connected to a lead-out line; a distal contact pad electrically connected to an externally exposed end of a coil pattern; and a power supply unit inputting and outputting power to the lead-out pad and the distal contact pad, wherein the shield part includes: at least one or more magnetic sheets stacked on one another and a coil pattern formed on the magnetic sheets, at least one of the magnetic sheets having a groove formed in one surface thereof or a through hole formed therein, and a coil lead-out portion embedded in the groove or through hole of the magnetic sheets, wherein the coil lead-out portion includes a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof, and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line.

Assignees

Inventors

Classifications

  • Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

  • H01F5/04Primary

    Arrangements of electric connections to coils, e.g. leads · CPC title

  • H01F27/365Primary

    Electricity · mapped topic

  • of the resonant type · CPC title

  • using inductive coupling · CPC title

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Frequently asked questions

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What does patent US9424983B2 cover?
There is provided a thin film coil, including a thin type coil pattern, and a coil lead-out portion including a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line.
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H01F5/04. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 23 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).