Thermally conductive silicone adhesive composition for reactor and reactor

Patent metadata

Field	Value
Publication number	US-9424977-B2
Application number	US-201414889560-A
Country	US
Kind code	B2
Filing date	May 2, 2014
Priority date	May 16, 2013
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting potting of fine substrates, having good properties after curing, having little change in properties even with heat or moist-heat aging, and giving good adhesiveness to metals and organic resins, and a reactor potted by this composition, can be provided by making a thermally conductive silicone adhesive composition having a viscosity of 100 mPa·s at 25° C. and containing a liquid organohydrogenpolysiloxane having 2-10 hydrogen atoms bonded with silicon atoms in the molecule, containing no alkoxy groups, having at least one epoxy group bonded with a silicon atom via an alkylene group, having a polysiloxane degree of polymerization of 15 or lower, and containing a polysiloxane skeleton having a cyclic structure.

First claim

The invention claimed is:

1. A heat conductive silicone adhesive composition for a reactor, comprising at least
(A) 100 parts by weight of an organopolysiloxane containing at least two silicon-bonded alkenyl groups in the molecule and having a viscosity of 0.05 to 1,000 Pa·s at 25° C.,
(B) 0.01 to 30 parts by weight of a liquid organohydrogenpolysiloxane having a viscosity of up to 100 mPa·s at 25° C., containing 2 to 10 silicon-bonded hydrogen atoms (SiH groups) in the molecule, free of alkoxy groups, containing at least one epoxy group bonded to a silicon atom via an alkylene group, the polysiloxane having a degree of polymerization of up to 15 and having a cyclic structure-containing skeleton,
(C) 5 to 4,000 parts by weight of a heat conductive filler,
(D) an amount to promote cure of the composition of a hydrosilylation catalyst,
(E) 0.1 to 100 parts by weight of an organopolysiloxane containing in the molecule at least one silyl group of the general formula (1):
—SiR 1 a R 2 3-a   (1)

wherein R 1 is a substituted or unsubstituted monovalent hydrocarbon group, R 2 is an alkoxy or acyloxy group of 1 to 8 carbon atoms, and a is 0, 1 or 2, and having a viscosity of 0.01 to 30 Pa·s at 25° C., the polysiloxane having a cyclic structure-free skeleton, and
(F) 0.01 to 10 parts by weight of acetylene black obtained from pyrolysis of acetylene and having a bulk density of 0.06 to 0.18 g/cm 3 ,
a molar ratio of SiH groups in component (B) to alkenyl groups in component (A), that is, SiH/alkenyl being 0.2/1 to 5.0/1.

2. The heat conductive silicone adhesive composition of claim 1 wherein component (B) is selected from organohydrogenpolysiloxanes having the following general formulae:

wherein m is an integer of 1 to 6.

3. The heat conductive silicone adhesive composition of claim 1 or 2 wherein component (C) is at least one member selected from the group consisting of aluminum hydroxide, magnesium hydroxide, aluminum oxide, crystalline silica, zinc oxide, silicon oxide, silicon carbide, silicon nitride, magnesium oxide, titanium oxide, beryllium oxide, aluminum nitride, boron nitride, gold, silver, copper, iron, nickel, aluminum, and stainless steel.

4. The heat conductive silicone adhesive composition of claim 1 wherein component (E) is selected from among
molecular chain dual end trimethoxysiloxy-blocked dimethylsiloxane,
molecular chain dual end trimethoxysiloxy-blocked dimethylsiloxane/methylvinylsiloxane copolymer,
molecular chain dual end trimethoxysiloxy-blocked methylvinylpolysiloxane,
molecular chain dual end trimethoxysiloxy-blocked dimethylsiloxane/methylvinylsiloxane/methylphenylsiloxane copolymer,
molecular chain dual end trimethoxysiloxy-blocked dimethylsiloxane/methylvinylsiloxane/diphenylsiloxane copolymer,
molecular chain dual end dimethoxymethylsiloxy-blocked dimethylpolysiloxane,
molecular chain dual end dimethoxyvinylsiloxy-blocked dimethylpolysiloxane,
molecular chain dual end dimethoxyvinylsiloxy-blocked methylvinylpolysiloxane,
molecular chain dual end dimethoxyvinylsiloxy-blocked dimethylsiloxane/methylvinylsiloxane copolymer,
molecular chain dual end dimethoxyvinylsiloxy-blocked dimethylsiloxane/methylvinylsiloxane/methylphenylsiloxane copolymer,
molecular chain dual end dimethoxyvinylsiloxy-blocked dimethylsiloxane/methylvinylsiloxane/diphenylsiloxane copolymer,
molecular chain dual end divinylmethoxysiloxy-blocked dimethylpolysiloxane, and
molecular chain single end trimethoxysiloxy-blocked dimethylsiloxane.

5. The heat conductive silicone adhesive composition of claim 1 , having a thermal conductivity of at least 0.5 W/m·K in the cured state.

6. A reactor potted in the heat conductive silicone adhesive composition of claim 1 .

Assignees

• Shinetsu Chemical Co
• Toyota Motor Co Ltd

Inventors

• Iwata Mitsuhiro
• Kobayashi Masami
• Nakanishi Koji
• Imanishi Hiroyuki
• Yamazaki Hikohito

Classifications

• C09J11/04 Primary

  inorganic · CPC title

• H01F27/06

  Mounting, supporting or suspending transformers, reactors or choke coils {not being of the signal type} · CPC title

• H01F37/00

  Fixed inductances not covered by group H01F17/00 · CPC title

• C09J183/06

  containing silicon bound to oxygen-containing groups (C09J183/12 takes precedence) · CPC title

• C09J9/00

  Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence) · CPC title