High temperature curing oven

Patent metadata

Field	Value
Publication number	US-9423636-B2
Application number	US-201214119318-A
Country	US
Kind code	B2
Filing date	Dec 18, 2012
Priority date	Jul 16, 2012
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

Embodiments of the invention provide a high temperature curing oven, comprising: a heating cavity a heater and a temperature monitor system. The heater includes a plurality of heating modules that can be controlled independently. The temperature monitor system includes: a thermocouple; an infrared monitor device; a signal processing module; and an executing module.

First claim

What is claimed is:

1. A high temperature curing oven for heating a plurality of substrates, comprising: a heating cavity, a heater and a temperature monitor system for monitoring a curing temperature inside the heating cavity, wherein:
the heater includes a plurality of heating modules that can be controlled independently,
the temperature monitor system comprises:
at least one thermocouple for monitoring a temperature information of an inner environment of the heating cavity;
an infrared monitor device for monitoring a surface temperature information of each layer of substrates inside the heating cavity and generating a temperature signal according to the surface temperature information;
a signal processing module signally connecting to the thermocouple and the infrared monitor device, and generating an executive command when judging that there exists a substrate with abnormal curing temperature which has an excessively high temperature point and/or an excessively low temperature point according to the temperature information from the thermocouple and the temperature signal from the infrared monitor device; and
an executing module signally connecting to the signal processing module, and adjusting a heating power of the heating module corresponding to the substrate with abnormal curing temperature in the heater according to the executive command generated by the signal processing module,
wherein the infrared monitor device comprises:
at least one infrared camera tube, which is disposed inside the heating cavity and monitors the surface temperature information of each layer of substrates inside the heating cavity;
a sliding rail, which is disposed on a side wall of the heating cavity;
a driving device, which is capable of driving the infrared camera tube to slide along the sliding rail; and
an infrared signal receiving-and-processing device, which signally connects to each infrared camera tube and generates the temperature signal according to the surface temperature information,
the infrared signal receiving-and-processing device signally connects to the signal processing module.

2. The high temperature curing oven according to claim 1 , wherein the heating modules correspond to the substrates disposed in the heating cavity in a one-to-one manner.

3. The high temperature curing oven according to claim 1 , wherein each of the heating modules includes at least one resistance heating wire, each of which can be controlled independently.

4. The high temperature curing oven according to claim 1 , wherein
the infrared signal receiving-and-processing device further generates an infrared imaging signal according to the surface temperature information monitored by the infrared camera tube,
the infrared monitor device further includes a display device, the display device signally connects to the infrared signal receiving-and-processing device and generates an image according to the infrared imaging signal generated by the infrared signal receiving-and-processing device.

5. The high temperature curing oven according to claim 1 , wherein the infrared camera tube is one infrared camera tube, which reciprocally slides along the sliding rail between a substrate in a highest layer and a substrate in a lowest layer inside the heating cavity.

6. The high temperature curing oven according to claim 1 , wherein there exist a plurality of the infrared camera tubes, each of which corresponds to one layer of substrate inside the heating cavity,
the sliding rail is a horizontal slid rail which corresponds to the infrared camera tube in a one-to-one manner, and each infrared camera tube is capable of sliding reciprocally along its corresponding horizontal sliding rail.

7. The high temperature curing oven according to claim 1 , wherein the signal processing module is a programmable logic controller (PLC).

8. The high temperature curing oven according to claim 1 , wherein the executing module includes a plurality of solid state relays and controls a switching of each of the solid state relays according to the executive command from the signal processing module so as to adjust the heating power of the heating module corresponding to the substrate with abnormal curing temperature in the heater.

Assignees

• Boe Technology Group Co Ltd
• Hefei Boe Optoelectronics Tech

Inventors

• Jing Yangkun

Classifications

• F27D11/02

  Ohmic resistance heating · CPC title

• G01J5/0066

  for hot spots detection · CPC title

• F27D2019/0003

  Monitoring the temperature or a characteristic of the charge and using it as a controlling value · CPC title

• G01K13/00 Primary

  Thermometers specially adapted for specific purposes · CPC title

• G02F1/1303 Primary

  Apparatus specially adapted to the manufacture of LCDs · CPC title