Bellows and method for manufacturing same

US9422933B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9422933-B2
Application numberUS-201214117950-A
CountryUS
Kind codeB2
Filing dateApr 19, 2012
Priority dateMay 18, 2011
Publication dateAug 23, 2016
Grant dateAug 23, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A conductive coating layer 2 a , 2 b is formed on at least one of an inner peripheral side and an outer peripheral side of a base body 2 of bellows 1 by diffusion-bonding. Regarding the diffusion-bonding, the flat conductive coating layer 2 a , 2 b is layered on at least one end surface side of the plate-shaped base body 2 , and these base body 2 and conductive coating layer 2 a , 2 b are diffusion-bonded. After forming this diffusion-bonded multilayer member into a tubular body by a drawing process, a side wall of the tubular body is formed into a bellows shape. With these processes, it is possible to obtain the bellows that has the conductive coating layer having a more uniform thickness on the base body of the bellows and has extremely good characteristics (the mechanical characteristics and the electric characteristics).

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing bellows comprising: arranging a flat conductive coating layer on at least one end surface side of a plate-shaped base body in layer; diffusion-bonding the base body and the conductive coating layer; forming a diffusion-bonded multilayer member into a tubular body by a drawing process; and forming a side wall of the tubular body into a bellows shape. 2. The method for manufacturing the bellows as claimed in claim 1 , wherein: the base body is formed from a nonmagnetic stainless material. 3. The method for manufacturing the bellows as claimed in claim 1 , wherein: the conductive coating layer is formed from a conductive material that contains at least one of copper, silver and gold. 4. Bellows manufactured by the method of claim 1 . 5. Bellows for a vacuum casing, which divides an inside of the vacuum casing into a vacuum chamber and an atmospheric chamber and keeps the vacuum chamber airtight, comprising: a base body; and a conductive coating layer, wherein the base body and the conductive coating layer are bonded by diffusion-bonding, and wherein a thickness of the conductive coating layer is uniform. 6. The bellows for the vacuum casing as claimed in claim 5 , wherein: a variation of the thickness of the conductive coating layer is an average of ±1% or less. 7. Bellows for a vacuum casing, which divides an inside of the vacuum casing into a vacuum chamber and an atmospheric chamber and keeps the vacuum chamber airtight, comprising: a base body; a conductive coating layer; and a diffusion-bond configured to bond the base body and the conductive coating layer, wherein a thickness of the conductive coating layer is uniform. 8. The bellows for the vacuum casing as claimed in claim 7 , wherein: a variation of the thickness of the conductive coating layer is an average of ±1% or less.

Assignees

Inventors

Classifications

  • of flexible wall, expansible chamber devices [e.g., bellows] · CPC title

  • Metallic bellows · CPC title

  • F04B45/02Primary

    having bellows · CPC title

  • F16J3/041Primary

    Non-metallic bellows · CPC title

  • Details · CPC title

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Frequently asked questions

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What does patent US9422933B2 cover?
A conductive coating layer 2 a , 2 b is formed on at least one of an inner peripheral side and an outer peripheral side of a base body 2 of bellows 1 by diffusion-bonding. Regarding the diffusion-bonding, the flat conductive coating layer 2 a , 2 b is layered on at least one end surface side of the plate-shaped base body 2 , and these base body 2 and conductive coating la…
Who is the assignee on this patent?
Tatsumi Toshinori, Takahashi Eiichi, Meidensha Electric Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification F04B45/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 23 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).