Hard film for cutting tool

Patent metadata

Field	Value
Publication number	US-9422627-B2
Application number	US-201314398126-A
Country	US
Kind code	B2
Filing date	Mar 18, 2013
Priority date	May 2, 2012
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

Provided is a hard film for a cutting tool formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure formed by sequentially stacking a thin layer A, a thin layer B, a thin layer C and a thin layer D or being comprised of a structure formed by repeatedly stacking the nano multi-layered structure at least twice, wherein the thin layer A is comprised of Ti x Al 1-x N (0.5≦x≦0.7); the thin layer B is comprised of Al 1-y-z Ti y Me z N (0.4≦y≦0.7, 0<z≦0.1 where Me is at least one of Si, Cr, and Nb); the thin layer C is comprised of Al a Ti 1-a N (0.5≦a≦0.7); and the thin layer D is comprised of Al b Cr 1-b N (0.5≦b≦0.7).

First claim

The invention claimed is:

1. A hard film for a cutting tool formed on a surface of a base material, comprising:
a nano multi-layered structure comprising a thin layer A, a thin layer B, a thin layer C and a thin layer D, which are sequentially stacked on the surface of the base material, wherein the nano multi-layered structure is repeatedly stacked at least twice, wherein,
the thin layer A is comprised of Ti x Al 1-x N(0.5≦x≦0.7),
the thin layer B is comprised of Al 1-y-z Ti y Me z N (0.4≦y≦0.7, 0<z≦0.1 where Me is at least one of Si, Cr, and Nb),
the thin layer C is comprised of Al a Ti 1-a N(0.5<a≦0.7), and
the thin layer D is comprised of Al b Cr 1-b N(0.5≦b≦0.7).

2. The hard film of claim 1 , wherein each of the thin layer A, the thin layer B, the thin layer C and the thin layer D has an average thickness of 3 nm to 50 nm.

3. The hard film of claim 1 , wherein each of the thin layer A, the thin layer B, the thin layer C and the thin layer D has an average thickness of 20 nm to 40 nm.

4. The hard film of claim 1 , wherein the hard film has an average thickness of 1 μm to 20 μm.

5. The hard film of claim 1 , wherein the hard film has a degradation hardness not less than 35 GPa or more when degradation-treated at a temperature of 900° C. for 30 minutes.

Assignees

• Korloy Inc

Inventors

• Kang Jae-Hoon
• Park Je-Hun
• Ahn Seung-Su
• Kim Sung-Hyun
• Kim Jung-Wook
• Lee Sung-Gu
• Ahn Sun-Yong
• Park Dong-Bok

Classifications

• Y10T428/24975

  No layer or component greater than 5 mils thick · CPC title

• C23C28/027

  including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC. · CPC title

• Y10T428/265

  1 mil or less · CPC title

• C23C14/0641

  Nitrides (C23C14/0617 takes precedence) · CPC title

• C23C14/32

  by explosion; by evaporation and subsequent ionisation of the vapours {, e.g. ion-plating}(C23C14/34 - C23C14/48 take precedence) · CPC title