Structure and structure manufacturing method

Patent metadata

Field	Value
Publication number	US-9420735-B2
Application number	US-201214119159-A
Country	US
Kind code	B2
Filing date	Aug 9, 2012
Priority date	Aug 12, 2011
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

A structure includes a housing made of a dielectric substance, an electrically conductive member embedded in the housing so as to penetrate the housing, and an electrically conductive pattern which is provided on at least one of surfaces, in which the electrically conductive member lies by penetrating the housing, so that the electrically conductive pattern is electrically connected with the electrically conductive member. The electrically conductive pattern is made up of an electrically conductive film which has no self-shape retention property.

First claim

The invention claimed is:

1. A structure comprising:
a housing which is made of a dielectric substance;
an electrically conductive member which is embedded in the housing so as to penetrate the housing;
an electrically conductive pattern which is provided on one end face of the electrically conductive member and on one surface of the housing which one surface is adjacent to the one end face of the electrically conductive member, the electrically conductive pattern being electrically connected with the electrically conductive member; and
a spring terminal through which electric power passes to be directly supplied via the other end face of the electrically conductive member,
the electrically conductive pattern being made up of an electrically conductive film which has no substantial shape retention property,
the electrically conductive member being a solid block of metal having a columnar shape and a flange is provided on the other end face of the electrically conductive member to enhance waterproof property of the housing.

2. The structure as set forth in claim 1 , wherein:
the electrically conductive pattern is formed by applying an electrically conductive paste to the one of surfaces.

3. The structure as set forth in claim 2 , wherein:
the electrically conductive paste is an electrically conductive material having a viscosity and contains at least metal powder and a solvent; and
the electrically conductive film formed by applying the electrically conductive paste is hardened by at least partially removing the solvent by drying the electrically conductive paste.

4. The structure as set forth in claim 2 , wherein:
the electrically conductive pattern is formed by applying the electrically conductive paste to the one of surfaces by printing with use of a flexible printing plate.

5. The structure as set forth in claim 1 , wherein:
the electrically conductive pattern is made up of a flexible electrically conductive film.

6. The structure as set forth in claim 1 , wherein:
the electrically conductive member protrudes from the housing toward the electrically conductive pattern.

7. The structure as set forth in claim 2 , wherein:
the electrically conductive member is depressed with respect to the housing on a side on which the electrically conductive pattern is provided.

8. The structure as set forth in claim 7 , wherein:
the housing has a covering part that covers a periphery of a surface of the electrically conductive member which surface faces the electrically conductive pattern.

9. The structure as set forth in claim 2 , wherein:
asperities are provided on a surface of the electrically conductive member which surface is in contact with the electrically conductive pattern.

10. The structure as set forth in claim 9 , wherein:
the asperities encompass asperities which are deeper than the thickness of the electrically conductive pattern; and
the asperities deeper than the thickness of the electrically conductive pattern are arranged so as not to break up the electrically conductive pattern.

11. The structure as set forth in claim 9 , wherein:
the surface of the electrically conductive member which surface is in contact with the electrically conductive pattern has a surface shape made up of at least one selected from the group including (i) a shape in which the asperities are concentrically arranged, (ii) a shape in which the asperities are arranged to form a texture, (iii) a shape in which the asperities are arranged in a striped pattern, (iv) a shape in which the asperities are arranged in a lattice pattern, and (v) a shape in which the asperities are arranged in a spiral pattern.

12. The structure as set forth in claim 9 , wherein:
a region which is free of asperities is provided in a periphery of the surface of the electrically conductive member which surface is in contact with the electrically conductive pattern, the region having a width which is larger than an average depth of the asperities.

Assignees

• Katayama Tomofumi
• Hikino Nozomu
• Ohguchi Shuhhei
• Naito Takashi
• Takebe Hiroyuki
• Sharp Kk

Inventors

• Katayama Tomofumi
• Hikino Nozomu
• Ohguchi Shuhhei
• Naito Takashi
• Takebe Hiroyuki

Classifications

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• H05K5/0247 Primary

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• H01Q1/242 Primary

  specially adapted for hand-held use · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title