Conductive substrate comprising a metal fine particle sintered film

Patent metadata

Field	Value
Publication number	US-9420698-B2
Application number	US-201013202425-A
Country	US
Kind code	B2
Filing date	Feb 19, 2010
Priority date	Feb 20, 2009
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a base material of polyimide and the like and which has a high adhesive property with the base material and is provided with an excellent conductivity.
The conductive substrate of the present invention is prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and a cross section of the metal fine particle sintered film has a void rate of 1% or less.

First claim

What is claimed is:

1. A conductive substrate prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and in a cross section transecting the metal fine particle sintered film and base material the metal fine particle sintered film has a void rate of 1% or less.

2. The conductive substrate according to claim 1 , wherein a carbon content of an inside of the metal fine particle sintered film which is measured by an X ray photoelectron spectroscopy is less than 5%.

3. The conductive substrate according to claim 1 , wherein the metal or the metal oxide is at least one selected from copper, copper oxide and copper having an oxidized surface.

4. The conductive substrate according to claim 3 , wherein the metal fine particle sintered film comprises a copper nanoparticle sintered film having a peak area of a (111) face that is more than twice as large as a peak area of a (200) face in an X ray diffraction pattern of the copper nanoparticle sintered film.

5. The conductive substrate according to claim 1 , wherein a heterogeneous metal layer or a metal oxide layer is not provided between the metal fine particle sintered film and the base material.

6. The conductive substrate according to claim 1 , wherein the base material is a polyimide resin.

7. The conductive substrate according to claim 1 , wherein the sintering is carried out under an inert gas atmosphere or a reducing as atmosphere.

8. The conductive substrate according to claim 1 , wherein the sintering is carried out by a surface wave plasma generated by applying a microwave energy.

9. A production process for a conductive substrate comprising a step of printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and a step of subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and in a cross section transecting the metal fine particle sintered film and base material the metal fine particle sintered film has a void rate of 1% or less.

10. The production process for a conductive substrate according to claim 9 , wherein a carbon content of an inside of the metal fine particle sintered film which is measured by an X ray photoelectron spectroscopy is less than 5%.

11. The production process for a conductive substrate according to claim 9 , wherein the metal or the metal oxide is at least one selected from copper, copper oxide and copper having an oxidized surface.

12. The production process for a conductive substrate according to claim 11 , wherein the metal fine particle sintered film comprises a copper nanoparticle sintered film having a peak area of a (111) face that is more than twice as large as a peak area of a (200) face in an X ray diffraction pattern of the copper nanoparticle sintered film.

13. The production process for a conductive substrate according to claim 9 , wherein a heterogeneous metal layer or a metal oxide layer is not provided between the metal fine particle sintered film and the base material.

14. The production process for a conductive substrate according to claim 9 , wherein the base material is a polyimide resin.

15. The production process for a conductive substrate according to claim 9 , wherein the sintering is carried out under an inert gas atmosphere or a reducing as atmosphere.

16. The production process for a conductive substrate according to claim 9 , wherein the sintering is carried out by a surface wave plasma generated by applying a microwave energy.

17. The production process for a conductive substrate according to claim 16 , wherein the sintering treatment is carried out at a heating rate of 100° C./minute or more.

18. The conductive substrate according to claim 1 , wherein the metal fine particle sintered film forms a conductive layer.

19. The production process for a conductive substrate according to claim 9 , wherein the metal fine particle sintered film forms a conductive layer.

20. A conductive substrate prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and a cross section transecting the metal fine particle sintered film and base material the metal fine particle sintered film has a void rate of 1% or less, and wherein a heterogeneous metal layer or a metal oxide layer is not provided between the metal fine particle sintered film and the base material.

Assignees

• Yoshi Naonobu
• Hojo Mikiko
• Dainippon Printing Co Ltd

Inventors

• Yoshi Naonobu
• Hojo Mikiko

Classifications

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K2203/1131

  Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity · CPC title

• H05K3/1283 Primary

  After-treatment of the printed patterns, e.g. sintering or curing methods · CPC title