Coating system with electrostatic discharge protection

Patent metadata

Field	Value
Publication number	US-9420686-B2
Application number	US-201314758820-A
Country	US
Kind code	B2
Filing date	Dec 20, 2013
Priority date	Jan 9, 2013
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

A coating system on a substrate for the protection against electrostatic discharge, includes in the following order a) an undercoat on the substrate, b) a non-dissipative synthetic resin layer and c) a dissipative synthetic resin layer having a resistance to ground according to VDE-0100-410 of at least 100 kohm, wherein a grounding device for grounding the coating system is arranged between the dissipative synthetic resin layer and the non-dissipative synthetic resin layer. The coating system can be a floor coating system. In this way, systems having low TVOC emission can be formed. This system structure is also suitable for the simple conversion of existing, purely insulating coating structures into systems with ESD capability, and the system structure can be very easily renewed if renovation is required because of wear.

First claim

The invention claimed is:

1. A coating system on a substrate for the protection against electrostatic discharge, comprising in the following order
a) an undercoat on the substrate,
b) a non-dissipative synthetic resin layer; and
c) a dissipative synthetic resin layer having a resistance to ground according to VDE-0100-410 of at least 100 kohm,
wherein a grounding device for grounding the coating system is arranged between the dissipative synthetic resin layer and the non-dissipative synthetic resin layer.

2. The coating system according to claim 1 , wherein the coating system is a floor coating system.

3. The coating system according to claim 2 , wherein the coating system has no conductive film.

4. The coating system according to claim 1 ,
wherein the coating system has no conductive film.

5. The coating system according to claim 4 , wherein a scratch coat for leveling is arranged between the undercoat and the non-dissipative synthetic resin layer.

6. The coating system according to claim 1 , wherein a scratch coat for leveling is arranged between the undercoat and the non-dissipative synthetic resin layer.

7. The coating system according to claim 6 , wherein the non-dissipative synthetic resin layer has a layer thickness in the range of 0.5 to 20 mm and/or wherein the dissipative synthetic resin layer has a layer thickness in the range of 20 to 5000 μm.

8. The coating system according to claim 1 , wherein the non-dissipative synthetic resin layer has a layer thickness in the range of 0.5 to 20 mm and/or wherein the dissipative synthetic resin layer has a layer thickness in the range of 20 to 5000 μm.

9. The coating system according to claim 8 , wherein the non-dissipative synthetic resin layer and/or the dissipative synthetic resin layer have very low TVOC emission.

10. The coating system according to claim 1 , wherein the non-dissipative synthetic resin layer and/or the dissipative synthetic resin layer have very low TVOC emission.

11. The coating system according to claim 10 , wherein the non-dissipative synthetic resin layer has a resistance to ground of more than 10 9 ohm, determined according to IEC 61340-4-1, and/or wherein the dissipative synthetic resin layer has a resistance to ground of no more than 10 9 ohm, determined according to IEC 61340-4-1.

12. The coating system according to claim 1 , wherein the non-dissipative synthetic resin layer has a resistance to ground of more than 10 9 ohm, determined according to IEC 61340-4-1, and/or wherein the dissipative synthetic resin layer has a resistance to ground of no more than 10 9 ohm, determined according to IEC 61340-4-1.

13. The coating system according to claim 1 , wherein the synthetic resin layers and the synthetic resin undercoat are made of cured reaction resins or reaction resin compounds, which optionally contain one or more additives, the reaction resins that are used for the respective layer or undercoat independently of one another being selected from epoxy resins, polyurethanes, polyureas, mixtures of polyurethanes and polyureas, polymethacrylates, polyacrylates, cementitious hybrid systems, and polymer-modified cementitious mixtures.

14. The coating system according to claim 1 , wherein the non-dissipative synthetic resin layer contains one or more additives selected from solvents and water, coloring agents such as colored quartz, dyes, pigments and color chips; fillers, such as quartz sands, ceramic powders, sand, chalk, fibers, hollow spheres and glass beads, emulsifiers, thixotropic agents, and film-forming aids.

15. The coating system according to claim 1 , wherein the dissipative synthetic resin layer contains one more conductive additives for setting the electrical properties, for example, carbon fibers, carbon black, graphite, silicon carbide, metal oxides, metals such as iron, ammonium salts, heavy metal-containing or metal-containing fillers, especially antimony- and tin-containing fillers based on titanium dioxide or mica, ionic liquids, ionic and nonionic surfactants, melamine sulfonates and polycarboxylate ethers.

16. The coating system according to claim 1 , wherein the system resistance is less than 10 9 ohm and/or the body voltage is less than 100 volt, measured according to IEC-61340-4-5.

17. A method for producing a coating system on a substrate for the protection against electrostatic discharge according to claim 1 , comprising the following steps:
a) Applying an undercoat composition to the substrate and curing to form an undercoat;
b) optionally applying, and curing, a scratch coat to the undercoat for leveling
c) applying a reaction resin composition to the undercoat or the scratch coat and curing to form a non-dissipative synthetic resin layer;
d) installing a grounding device on the non-dissipative synthetic resin layer for grounding the coating system; and
e) applying a reaction resin composition over the grounding device and the non-dissipative synthetic resin layer and curing to form the dissipative synthetic resin layer having a resistance to ground according to VDE-0100-410 of at least 100 kohm.

18. A method for converting an existing coating system, comprising
a) an undercoat on the substrate, optionally a scratch coat for leveling, and b) a non-dissipative synthetic resin layer, for producing a coating system on a substrate for the protection against electrostatic discharge according to claim 1 , comprising the following steps:
a) installing a grounding device on the non-dissipative synthetic resin layer of the existing coating system to ground the coating system; and
b) applying a reaction resin composition over the grounding device and the non-dissipative synthetic resin layer and curing to form the dissipative synthetic resin layer having a resistance to ground according to VDE-0100-410 of at least 100 kohm.

19. The method for renovating a coating system on a substrate for the protection against electrostatic discharge according to claim 1 in which the dissipative synthetic resin layer is partially worn away, comprising:
a) applying a reaction resin composition over the dissipative synthetic resin layer and curing to form the dissipative synthetic resin layer having a resistance to ground according to VDE-0100-410 of at least 100 kohm.

20. The method according to either claim 18 , wherein, before applying the new dissipative synthetic resin layer, the existing partially worn away dissipative synthetic resin layer, or before installation of the grounding device, the existing non-dissipative synthetic resin layer is subjected to a pretreatment, for example, grinding, sand-blasting, shot-blasting or stripping with solvents or acids.

Assignees

• Sika Tech Ag

Inventors

• Von Der Brueggen Uwe
• Conrad Lars
• Heinrich Henry
• Groetzinger Jochen

Classifications

• H05K1/0313 Primary

  Organic insulating material · CPC title

• H05K1/0215

  Grounding of printed circuits by connection to external grounding means · CPC title

• H05K2203/0759

  Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer · CPC title

• H05K3/4673

  Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28) · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title