Sensing product and method of making

Patent metadata

Field	Value
Publication number	US-9419155-B2
Application number	US-201213343922-A
Country	US
Kind code	B2
Filing date	Jan 5, 2012
Priority date	Jan 5, 2012
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

This description relates to a sensing product formed using a substrate with a plurality of epi-layers. At least a first epi-layer has a different composition than the composition of a second epi-layer. The sensing product optionally includes at least one radiation sensing element in the second epi-layer and optionally an interconnect structure over the second epi-layer. The sensing product is formed by removing the substrate and all epi-layers other than the second epi-layer. A light incident surface of the second epi-layer has a total thickness variation of less than about 0.15 μm.

First claim

What is claimed is:

1. A method of making a semiconductor device, the method comprising:
forming at least one radiation sensing element in a second epi-layer of an intermediate product, wherein the intermediate product comprises a substrate, a first epi-layer over the substrate and the second epi-layer over the first epi-layer, wherein the second epi-layer has a different composition from the first epi-layer, and the second epi-layer has a doped surface extending across the entire second epi-layer in a direction parallel to an interface between the first epi-layer and the substrate;
forming an interconnect layer over the second epi-layer of the intermediate product to electrically connect with the at least one radiation sensing element; and
removing the substrate and the entire first epi-layer to expose the entire doped surface of the second epi-layer.

2. The method of claim 1 , wherein the forming the at least one radiation sensing element comprises forming the at least one radiation sensing element in the second epi-layer having a total thickness variation of less than about 0.15 microns (μm).

3. The method of claim 1 , wherein the forming the at least one radiation sensing elements comprises at least one of ion implantation, etching a trench, or diffusing a radiation sensing material in the second epi-layer.

4. A method of making a semiconductor device comprising:
forming at least one radiation sensing element in a first epi-layer having a first dopant type, wherein the first epi-layer is over a second epi-layer having a second dopant type and a substrate, wherein the first dopant type is opposite the second dopant type, and the first epi-layer comprises a doped surface extending parallel to an interface between the substrate and the second epi-layer;
forming an interconnect layer over the first epi-layer, the interconnect layer electrically connected with the at least one radiation sensing element;
removing a portion of the substrate using a first process; and
removing the entire second epi-layer using a second process different from the first process, wherein removing the second epi-layer comprises exposing the entire doped surface of the first epi-layer having a total thickness variation of less than about 0.15 microns (μm), and the doped surface extends across every radiation sensing element of the at least one radiation sensing element.

5. The method of claim 4 , wherein removing the second epi-layer using the second process comprises removing a portion of the substrate using the second process.

6. The method of claim 5 , wherein removing the second epi-layer using the second process comprises removing the second epi-layer using a grinding or planarization process.

7. The method of claim 5 , wherein removing the second epi-layer using the second process comprises removing the second epi-layer using a selective etching process.

8. The method of claim 4 , wherein forming the at least one radiation sensing element in the first epi-layer comprises forming the at least one radiation sensing element in the first epi-layer comprising a silicon core material, and the second epi-layer comprises the silicon core material.

9. The method of claim 4 , wherein forming the at least one radiation sensing element comprises forming a plurality of radiation sensing elements.

10. The method of claim 4 , wherein forming the at least one radiation sensing element in the first epi-layer comprises forming the at least one radiation sensing element in the first epi-layer having a dopant concentration ranging from about 10 14 atoms/cm 3 to about 10 20 atoms/cm 3 .

11. The method of claim 4 , wherein forming the at least one radiation sensing element in the first epi-layer comprises forming the at least one radiation sensing element in the first epi-layer having a first dopant concentration, and the second epi-layer has a second dopant concentration different from the first dopant concentration.

Assignees

• Chang Shih-Chieh
• Lin Yu-Ku
• Wang Ying-Lang
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chang Shih-Chieh
• Lin Yu-Ku
• Wang Ying-Lang

Classifications

• H10F77/413

  directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42) · CPC title

• H10F71/00 Primary

  Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) · CPC title

• H10F30/21

  the devices being sensitive to infrared, visible or ultraviolet radiation · CPC title

• H10F77/40 Primary

  Optical elements or arrangements (surface textures H10F77/70) · CPC title

• H01L31/101

  Electricity · mapped topic