Light emitting diodes and a method of packaging the same

Patent metadata

Field	Value
Publication number	US-9418979-B2
Application number	US-201514967629-A
Country	US
Kind code	B2
Filing date	Dec 14, 2015
Priority date	Apr 20, 2012
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.

First claim

What is claimed:

1. A method of assembling an array of light emitting diode (LED) dies on a substrate comprising:
positioning dies in fluid;
exposing the dies to a magnetic force to attract the dies onto a front side of a substrate using magnets that are arranged at pre-determined locations either directly on the backside of the substrate or near the backside of the substrate; and
forming permanent electrical and/or mechanical connections between the dies and the substrate thereby constituting an array of LED dies on a substrate,
wherein the exposing further comprises exposing the dies to a magnetic force that is arranged either on or beneath the substrate and beneath a surface of the fluid to sink the dies beneath the surface of the fluid and onto respective ones of the magnets that are arranged either on or near the substrate, and
wherein prior to the positioning, the method further comprises forming a buoyant layer on one side of each of the dies.

2. The method of claim 1 , wherein the exposing further comprises seating the dies in respective apertures of a mask that is applied over top of the substrate, wherein the apertures correspond in position to the magnets.

3. The method of claim 2 , wherein prior to the forming, the method further comprises removing the mask while leaving the dies in their respective positions on the substrate.

Assignees

• Rensselaer Polytech Inst
• Renssealer Polytechnic Inst

Inventors

• Karlicek Jr Robert F
• Lu James Jian-Qiang
• Goodwin Charles Sanford
• Tkachenko Anton

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/0198

  batch processes · CPC title