Optoelectronic component with protective circuit

Patent metadata

Field	Value
Publication number	US-9418972-B2
Application number	US-201314429390-A
Country	US
Kind code	B2
Filing date	Sep 27, 2013
Priority date	Sep 27, 2012
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein each diode has two electrical connections, each electrical connection is led to a contact area, the contact areas are arranged on an underside of the first carrier, and a second carrier, wherein at least two zener diodes are arranged in the second carrier, the zener diodes have further electrical connections, each further electrical connection is led to a further contact area, the further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and is fixedly connected to the second carrier, and the zener diodes antiparallelly connect to the diodes.

First claim

The invention claimed is:

1. An optoelectronic component comprising:
at least one first carrier with at least two light emitting diodes, wherein each diode has two electrical connections, each electrical connection is led to a contact area, and the contact areas are arranged on an underside of the first carrier; and
a second carrier, wherein at least two zener diodes are arranged in the second carrier, the zener diodes have further electrical connections, each further electrical connection is led to a further contact area, the further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and fixedly connects to the second carrier, the zener diodes antiparallelly connect to the diodes, the contact areas of a diode electrically contact the further contact areas of a zener diode, the zener diodes electrically connect in series, the diodes electrically connect in series, wherein the further connections of the at least two zener diodes are insulated from one another and an electrically conductive connection of the two zener diodes is produced via an electrical line, and the electrical line is on or in the first carrier.

2. The component as claimed in claim 1 , wherein the first carrier comprises a semiconducting layer in which the diodes are embodied.

3. The component as claimed in claim 1 , wherein the first carrier and/or the second carrier are/is at least part of a silicon wafer.

4. The component as claimed in claim 1 , wherein between two contact areas, at least two diodes are arranged in a manner connected in series and/or in parallel and/or wherein between two further contact areas at least two zener diodes are arranged in a manner connected in series and/or in parallel.

5. The component as claimed in claim 1 , wherein an electronic circuit for open-loop and/or closed-loop control of the power supply of the diodes is integrated in the second carrier.

6. The component as claimed in claim 1 , wherein the connections of the at least two diodes are insulated from one another and an electrically conductive connection of the two diodes is produced by the connection of the first carrier to the second carrier via an electrical line, and the electrical line is on or in the second carrier.

7. The component as claimed in claim 1 , wherein a controllable switch is provided in parallel with at least one diode, the switch is integrated in the second carrier, a control circuit is integrated in the second carrier, and the control circuit connects to the switch.

8. The component as claimed in claim 1 , wherein a sensor is integrated in the second carrier, the sensor connects to a control circuit, and the sensor is an optical sensor or a temperature sensor.

9. A method of producing an optoelectronic component comprising a first wafer, wherein at least two light emitting diodes are arranged on the first wafer, two electrical connections are provided for the diodes, a contact area is provided for each electrical connection, said contact area connecting to an electrical connection, the contact areas are arranged on an underside of the first wafer, at least two zener diodes are provided on a second wafer, the zener diodes connect to further electrical connections, the first wafer is placed by the underside onto the top side of the second wafer and connects to the second wafer, the contact areas of a diode and the further contact areas of a zener diode are brought into contact via electrical lines, the first wafer is arranged and connected to the second wafer such that a zener diode antiparallelly connects to the diode, the zener diodes are electrically connected in series, and the diodes are electrically connected in series, wherein the series connection of the zener diodes and of the diodes is produced by an electrical line applied on the second wafer, or the series connection of the zener diodes and of the diodes is produced by an electrical line applied on the first wafer.

10. The method as claimed in claim 9 , wherein the first wafer and/or the second wafer are/is a silicon wafer.

11. The method as claimed in claim 9 , wherein the first wafer constitutes a plurality of first carriers, the second wafer constitutes a plurality of second carriers, a first carrier with at least two light emitting diodes, each diode has two electrical connections, each electrical connection is led to a contact area, the contact areas are arranged on an underside of the first carrier, at least two zener diodes are arranged in a second carrier, the zener diodes have further electrical connections, each further electrical connection is led to a further contact area, the further contact areas are arranged on a top side of the second carrier, and wherein, when the wafers are placed one on top of another, a first carrier is placed by the underside on the top side of a second carrier and fixedly connects to the second carrier, the zener diodes antiparallelly connect to the diodes, the contact areas of a diode are electrically in contact with the further contact areas of a zener diode, the zener diodes electrically connect in series, the diodes electrically connect in series, the connected wafers are divided into components, and a component comprises a first and a second carrier connected to one another.

12. The method as claimed in claim 9 , wherein, before the first wafer is fixed to the second wafer, the diodes are electrically insulated from one another and/or the zener diodes are electrically insulated from one another, and the electrically conductive connection is produced during the connection of the wafers by contact material.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Nagel Peter
• Illek Stefan

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10D8/25

  Zener diodes · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/018

  Bonding of wafers · CPC title