Packaging devices and methods of manufacture thereof

Patent metadata

Field	Value
Publication number	US-9418952-B2
Application number	US-201514632896-A
Country	US
Kind code	B2
Filing date	Feb 26, 2015
Priority date	Mar 11, 2013
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to a second portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element comprises a first side and a second side coupled to the first side. The first side and the second side of the transition element are non-tangential to the PPI pad.

First claim

What is claimed is:

1. A packaging device, comprising:
a contact pad disposed over a substrate;
a passivation layer disposed over the substrate and a first portion of the contact pad;
a post passivation interconnect (PPI) line disposed over the passivation layer and coupled to a second portion of the contact pad;
a PPI pad disposed over the passivation layer; and
a transition element disposed over the passivation layer and coupled between the PPI line and the PPI pad, wherein the transition element comprises a first side and a second side coupled to the first side, and wherein the first side and the second side of the transition element are non-tangential to the PPI pad and wherein an angle between the first side and the second side of the transition element comprises about 70 degrees proximate the PPI line.

2. The packaging device according to claim 1 , wherein the transition element comprises a hollow region.

3. The packaging device according to claim 2 , wherein the hollow region comprises a shape selected from the group consisting essentially of: a circle, an oval, a triangle, a triangle with a curved side or a curved corner, a rectangle, a rectangle with a curved side or a curved corner, a square, a square with a curved side or a curved corner, a polygon, a polygon with a curved side or a curved corner, a fragment of an annulus, and combinations thereof.

4. The packaging device according to claim 1 , wherein the transition element includes a third side coupled to the first side and the second side, wherein the first side and the second side are substantially straight, and wherein the third side is curved proximate the PPI pad.

5. The packaging device according to claim 1 , wherein a distance from a center of the PPI pad to the PPI line comprises about 100 μm to about 300 μm.

6. A packaging device, comprising:
a substrate;
a plurality of contact pads disposed over the substrate;
a passivation layer disposed over the substrate and a first portion each of the plurality of contact pads;
a post passivation interconnect (PPI) line disposed over the passivation layer and coupled to a second portion of each of the plurality of contact pads;
a PPI pad disposed over the passivation layer and coupled to each of the PPI lines, the PPI pads being arranged in an array; and
a plurality of transition elements disposed over the passivation layer and coupled between each of the PPI lines and each of the PPI pads in corners of the array, wherein each of the transition elements comprises a first side and a second side coupled to the first side, and wherein the first sides and the second sides of the transition elements are non-tangential to the PPI pads, wherein respective ones of the plurality of transition elements are coupled between each of the PPI lines and each of the PPI pads in corner regions of the array.

7. The packaging device according to claim 6 , wherein each of the transition elements comprises a substantially triangular shape, and wherein a corner of each of the triangular shaped transition elements points towards a center or a neutral point (NP) of the array.

8. The packaging device according to claim 6 , wherein one of the plurality of transition elements is coupled between each of the PPI lines and each of the PPI pads in edge regions of the array.

9. The packaging device according to claim 6 , wherein the array of the PPI pads comprises a predetermined desired value of a distance to a neutral point (DNP 1 ), and wherein a distance to a neutral point (DNP) of each of the plurality of PPI pads in the corners of the array is greater than the DNP 1 .

10. The packaging device according to claim 9 , wherein transition elements in regions other than the corners of the array comprise a DNP of greater than DNP 1 and comprise the first sides and the second sides that are non-tangential to the PPI pads.

11. The packaging device according to claim 10 , wherein the PPI pads comprise a plurality of first PPI pads, wherein the PPI pads further comprise a plurality of second PPI pads, and wherein each of the plurality of second PPI pads comprises a DNP of about DNP 1 or less.

12. The packaging device according to claim 11 , wherein the transition elements comprise first transition elements; wherein the PPI lines comprise first PPI lines; wherein the plurality of contact pads comprise first contact pads; wherein the passivation layer is disposed over a first portion each of a plurality of second contact pads; wherein a second PPI line is disposed over the passivation layer and is coupled to a second portion of each of the plurality of second contact pads; wherein a second PPI pad is disposed over the passivation layer and is coupled to each of the second PPI lines; wherein a second a transition element is disposed over the passivation layer and is coupled between each of the second PPI lines and each of the second PPI pads; wherein each of the second transition elements comprises a first side and second side coupled to the first side; and wherein the first sides and the second sides of the second transition elements are substantially tangential to the second PPI pads.

13. The packaging device according to claim 12 , wherein an angle between the first side and the second side of each of the first transition elements comprises about 70 degrees proximate the first PPI lines, or wherein an angle between the first side and the second side of each of the second transition elements proximate the second PPI lines comprises about 90 degrees.

14. The packaging device according to claim 12 , wherein the first transition elements or the second transition elements comprise a hollow region.

15. A method of manufacturing a packaging device, the method comprising:
forming a contact pad over a substrate;
forming a passivation layer over the substrate and a first portion of the contact pad yet leaving a second portion of the contact pad exposed; and
forming a post passivation interconnect (PPI) line, a transition element, and a PPI pad over the passivation layer, wherein the PPI line is coupled to the second portion of the contact pad, wherein the transition element is coupled to the PPI line and comprises a substantially triangular shape, wherein an angle of two sides of the transition element comprises about 70 degrees proximate the PPI line, and wherein the PPI pad is coupled to the transition element.

16. The method according to claim 15 , wherein forming the PPI line, the transition element, and the PPI pad comprises forming a transition element wherein each of the two sides of the transition element is non-tangential to the PPI pad.

17. The method according to claim 15 , wherein forming the contact pad comprises forming a first contact pad, wherein forming the PPI line, the transition element, and the PPI pad comprises forming a first PPI line, a first transition element, and a first PPI pad, and wherein the method further comprises:
forming a second contact pad over the substrate;
forming the passivation layer over a first portion of the second contact pad yet leaving a second portion of the second contact pad exposed; and
forming a second PPI line, a second transition element, and a second PPI pad over the passivation layer, wherein the second PPI line is coupled to the second portion of the second contact pad, wherein the second transition element is coupled to the second PPI line, wherein the second PPI pad is coupled to the second transition element, and wherein an angle of two sides of the second transition element comprises about 90 degrees proximate the second PPI line.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Hsien-Wei
• Chen Jie

Classifications

• H10W80/743

  having disposition changed during the connecting · CPC title

• H10W74/147

  the encapsulations being multilayered · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title