Integrated circuit for generating or processing a radio frequency signal

Patent metadata

Field	Value
Publication number	US-9418945-B2
Application number	US-201214427036-A
Country	US
Kind code	B2
Filing date	Sep 14, 2012
Priority date	Sep 14, 2012
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

An integrated circuit includes a signal line for carrying a radio frequency signal; a coupling line inductively coupled to the signal line for delivering an induced signal in dependence on the radio frequency signal; a connecting line connected to a pick-off point of the coupling line for picking off the induced signal from the coupling line; and a conductive part for shielding the coupling line against electromagnetic interference and for enhancing inductive coupling between the signal line and the coupling line. The conductive part may have a uniform flat surface facing the coupling line. The signal line may extend parallel to the surface. The coupling line may extend parallel to the signal line and may be arranged between the surface and the signal line.

First claim

The invention claimed is:

1. An integrated circuit comprising:
a signal line for carrying a radio frequency signal;
a coupling line inductively coupled to said signal line for delivering an induced signal in dependence on said radio frequency signal;
a connecting line connected to a pick-off point of said coupling line for picking off said induced signal from said coupling line; and
a conductive part for shielding said coupling line against electromagnetic interference and for enhancing inductive coupling between said signal line and said coupling line;
said conductive part having a uniform flat surface facing said coupling line,
said signal line extending parallel to said surface,
said coupling line extending parallel to said signal line and arranged between said surface and said signal line.

2. The integrated circuit of claim 1 , with no further conductive elements arranged between said surface and said coupling line.

3. The integrated circuit of claim 1 , said coupling line having a length of not more than two percent of a vacuum wavelength of said radio frequency signal.

4. The integrated circuit of claim 3 , wherein said vacuum wavelength is less than one centimeter.

5. The integrated circuit of claim 1 , wherein said pick-off point is an end point of said coupling line.

6. The integrated circuit of claim 1 , further comprising:
a ground node for providing a ground voltage, and
a resistive element,
said pick-off point connected to said ground terminal via said connecting line -and said resistive element so as to limit reflections in said connecting line and in said coupling line.

7. The integrated circuit of claim 1 , comprising an output terminal for delivering said induced signal.

8. The integrated circuit of claim 1 , said connecting line and said coupling line forming an angle between 45 degrees and 135 degrees at said pick-off point.

9. The integrated circuit of claim 1 , wherein said coupling line is straight.

10. An integrated circuit comprising;
a signal line for carrying a radio frequency signal,
a coupling line inductively coupled to said signal line for delivering an induced signal in dependence on said radio frequency signal;
a connecting line connected to a pick-off point of said coupling line for picking off said induced signal from said coupling line;
a conductive part for shielding said coupling line against electromagnetic interference and for enhancing inductive coupling between said signal line and said coupling line, said conductive part having a uniform flat surface facing said coupling line, said signal line extending parallel to said surface, said coupling line extending parallel to said signal line and arranged between said surface and said signal line, and
several layers stacked atop each other, said layers including, in this order:
a first metal layer comprising said conductive part;
a first isolating layer;
a second metal layer comprising said coupling line;
a second isolating layer;
a third metal layer comprising said signal line; and
a third isolating layer;

with no further layers stacked between said layers.

11. The integrated circuit of claim 10 , said second metal layer further comprising said connecting line.

12. The integrated circuit of claim 10 , said connecting line extending from said pick-off point in a direction perpendicular to said layers.

13. The integrated circuit of claim 1 , further comprising a second connecting line connected to a second pick-off point of said coupling line for picking off said induced signal at said second pick-off point.

14. The integrated circuit of claim 1 , further comprising a second conductive part for shielding said coupling line against electromagnetic interference and for enhancing inductive coupling between said signal line and said coupling line; said second conductive part having a uniform flat surface facing said signal line and said surface of said first conductive part.

15. An integrated circuit comprising;
a signal line for carrying a radio frequency signal;
a coupling line inductively coupled to said signal line for delivering an induced signal in dependence on said radio frequency signal;
a connecting line connected to a pick-off point of said coupling line for picking off said induced signal from said coupling line;
a conductive part for shielding said coupling line against electromagnetic interference and for enhancing inductive coupling between said signal line and said coupling line, said conductive part having a uniform flat surface facing said coupling line, said signal line extending parallel to said surface, said coupling line extending parallel to said signal line and arranged between said surface and said signal line;
a second conductive part for shielding said coupling line against electromagnetic interference and for enhancing inductive coupling between said signal line and said coupling line; said second conductive part having a uniform flat surface facing said signal line and said surface of said first conductive part; and
several layers stacked atop each other, said layers including, in this order:
a first metal layer comprising said first conductive part;
a first isolating layer;
a second metal layer comprising said coupling line;
a second isolating layer;
a third metal layer comprising said signal line;
a third isolating layer; and
a fourth metal layer comprising said second conductive part;

with no further layers stacked between said layers.

16. The integrated circuit of claim 15 , wherein said second isolating layer has a thickness of between 1 and 10 micrometers (μm).

17. The integrated circuit of claim 1 , wherein said radio frequency signal is a 77 gigahertz (GHz) radar signal.

18. The integrated circuit of claim 1 , wherein a length of the coupling line is between 25 to 50 micrometers (μm).

19. The integrated circuit of claim 13 , wherein said pick-off point provides for picking off a forward wave induced signal of said induced signal and said second pick-off point provides for picking off a reverse wave induced signal of said induced signal.

20. The integrated circuit of claim 1 , wherein said radio frequency signal has a vacuum wavelength of 3.4 millimeters (mm).

Assignees

• Reuter Ralf
• Dehlink Bernhard
• Freescale Semiconductor Inc

Inventors

• Reuter Ralf
• Dehlink Bernhard

Classifications

• H10W20/43

  Layouts of interconnections · CPC title

• H10W42/20 Primary

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H01L23/528

  Electricity · mapped topic

• H01L23/552 Primary

  Electricity · mapped topic

• H01P5/184 Primary

  the guides being strip lines or microstrips · CPC title