Method of manufacturing a feedthrough

Patent metadata

Field	Value
Publication number	US-9418778-B2
Application number	US-201414203241-A
Country	US
Kind code	B2
Filing date	Mar 10, 2014
Priority date	Aug 2, 2011
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.

First claim

What is claimed is:

1. A method of manufacturing a feedthrough, comprising:
providing a ferrule having an opening;
providing an insulator body, including:
co-firing a structure comprising:
a material that is an electrical insulator; and
a conduit configured to conduct electricity through the electrical insulator;

cutting the structure to form the insulator body, wherein the insulator body includes a plurality of flat surfaces and a plurality of corners, each corner being positioned between two of the flat surfaces, wherein the plurality of flat surfaces include a pair of flat ends positioned at opposing ends of the insulator body along a longitudinal axis thereof;

inserting the insulator body into the opening of the ferrule; and
coupling the insulator body to the ferrule;
wherein the pair of flat ends of the insulator body are not ground before inserting the insulator body into the opening of the ferrule, and wherein the pair of flat ends are not machined or polished before inserting the insulator body into the opening of the ferrule.

2. The method of claim 1 , wherein during the step of providing an insulator body includes rounding the corners of the insulator body before inserting the insulator body into the opening of the ferrule.

3. A method of manufacturing feedthrough, comprising:
providing a ferrule having an opening;
cutting a fired ceramic material to form an insulator body having a plurality of flat surfaces and a plurality of corners, each corner being positioned between two of the flat surfaces, wherein the plurality of flat surfaces include a pair of flat ends positioned at opposing ends of the insulator body along a longitudinal axis thereof;
inserting the insulator body into the opening of the ferrule; and
coupling the insulator body to the ferrule;
wherein the pair of flat ends of the insulator body are not ground before inserting the insulator body into the opening of the ferrule, and wherein the pair of flat ends are not machined or polished before inserting the insulator body into the opening of the ferrule.

4. The method according to claim 3 , further comprising rounding the corners of the insulator body before inserting the insulator body into the opening of the ferrule.

5. The method according to claim 4 , wherein the step of rounding the corners includes tumbling the insulator body in an abrasive agent.

6. The method according to claim 3 , wherein the step of cutting the fired ceramic material utilizes a wafering saw.

7. The method according to claim 6 , wherein the wafering saw includes one or more diamond cutting blades.

8. The method according to claim 3 , wherein the step of cutting the fired ceramic material results in the insulator body having a rectilinear shape.

9. The method according to claim 3 , further comprising brazing the insulator body to the ferrule.

10. The method according to claim 3 , further comprising providing the fired ceramic material by:
providing a sheet of unfired ceramic material;
forming one or more holes through the unfired ceramic material;
inserting a first conductive material into the one or more holes;
forming a pad in electrical contact with the first conductive material in one of the plurality of holes, the pad comprising a second conductive material; and
co-firing the unfired ceramic material, the first conductive material, and the second conductive material.

11. The method according to claim 10 , wherein the step of forming the pad includes providing a plurality of layers overlaying each other to form the pad with a thickness of at least 50 micrometers, at least one layer comprising the second material.

12. The method according to claim 10 , wherein the ceramic material comprises alumina, the first conductive material is different than the ceramic material and comprises alumina and platinum, and the second conductive material is different than the ceramic material and the first conductive material and comprises platinum.

13. The method according to claim 10 , wherein providing the fired ceramic material further includes providing a second sheet of unfired ceramic material having one or more holes therethrough, inserting the first conductive material into the one or more holes of the second sheet, layering the second sheet with the first sheet with the one or more holes thereof in alignment; and
wherein the step of co-firing includes co-firing the unfired ceramic material of the first sheet, the unfired ceramic material of the second sheet, the first conductive material, and the second conductive material.

14. The method according to claim 10 , wherein the step of co-firing creates a hermetic seal between the unfired ceramic material and the first conductive material and between the first conductive material and the second conductive material.

15. The method according to claim 10 , further comprising welding a lead to the pad subsequent to inserting the insulator into the ferrule.

Assignees

• Kyocera Corp
• Medtronic Inc

Inventors

• Morioka Kengo
• Fujii Keiichi
• Knudsen Arne
• Satou Shingo
• Otomaru Hidekazu
• Makino Hiroshi
• Thom Andrew
• Reiterer Markus
• Munns Gordon
• Miltich Thomas
• Yamamoto Joyce

Classifications

• H05K3/4046

  using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• H05K3/0044

  Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence) · CPC title

• H05K1/112

  directly combined with via connections · CPC title