Method and system for three-dimensional fabrication

US9417627B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9417627-B2
Application numberUS-201414329953-A
CountryUS
Kind codeB2
Filing dateJul 13, 2014
Priority dateApr 1, 2007
Publication dateAug 16, 2016
Grant dateAug 16, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of three-dimensional fabrication of an object is disclosed. The method comprises: forming a plurality of layers in a configured pattern corresponding to the shape of the three-dimensional object, at least one layer of the plurality of layers being formed at a predetermined and different thickness selected so as to compensate for post-formation shrinkage of the layer along a vertical direction. In various exemplary embodiments of the invention spread of building material of one or more layers is diluted at least locally such as to maintain a predetermined thickness and a predetermined planar resolution for the layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for three-dimensional fabrication of an object, comprising: a three-dimensional fabrication apparatus having a leveling device and being designed and constructed to form a plurality of layers of building material in a configured pattern corresponding to the shape of the three-dimensional object; a controller having a circuit configured to apply a dilution transformation to at least one bitmap respectively characterizing at least one layer of said plurality of layers, and to transmit control signals to said three-dimensional fabrication apparatus to ensure that for said at least one layer of said plurality of layers, said apparatus forms, according to said at least one transformed bitmap, an interior region surrounded by a peripheral region, wherein a thickness of said interior region is lower than a thickness of said peripheral region, wherein said leveling device is configured for leveling at least said peripheral region by removing material at least from said peripheral region so as to straighten at least said peripheral region. 2. The system of claim 1 , wherein said controller is designed and constructed to ensure that said apparatus forms said interior region by leaving void locations in said interior region to allow building material to flow into said void locations. 3. The system of claim 1 , wherein said dilution transformation comprises a local dilution corresponding to an interior portion of said at least one layer of said plurality of layers, to leave void locations in said interior region and to allow building material to flow into said void locations. 4. The system of claim 2 , wherein said interior region is characterized by a distance from a closest exterior surface of the object which is above a predetermined threshold distance. 5. The system of claim 2 , wherein said predetermined threshold distance equals about 2 millimeters. 6. The system of claim 2 , wherein said predetermined threshold distance is dependent on the spatial direction from the interior region to the exterior surface. 7. The system of claim 1 , wherein said controller is designed and constructed to maintain a predetermined thickness and a predetermined planar resolution for said at least one layer. 8. The system of claim 2 , wherein said void locations are selected so as to reduce the amount of building material removed as waste by said leveling device. 9. The system of claim 2 , further comprising a data processor for selecting said void locations at a bitmap level. 10. The system of claim 9 , wherein said data processor is configured for: preparing a preliminary bitmap according to a predetermined resolution; calculating an expected thickness of the layer resulting from said preliminary bitmap; calculating a ratio between said expected thickness and a predetermined thickness of the layer; and based on said ratio, selecting said void locations in said preliminary bitmap, thereby preparing a bitmap corresponding to said at least one layer. 11. The system of claim 10 , wherein a different dilution transformation is used for different regions in the layers and dilution is not performed in one or more successive layers above defective locations in a layer. 12. The system of claim 1 , wherein said leveling is prior to solidification of said layer. 13. The system of claim 1 , wherein said leveling device is a roller. 14. A system for three-dimensional fabrication of an object, comprising: a three-dimensional fabrication apparatus, designed and constructed to form a plurality of layers in a configured pattern corresponding to the shape of the three-dimensional object; and a controller having a circuit configured to apply a dilution transformation to at least one bitmap respectively characterizing at least one layer of said plurality of layers, and to transmit control signals to said three-dimensional fabrication apparatus to ensure that for at least one layer of said plurality of layers, said apparatus performs a local dilution of building material by leaving locations void of building material in at least one interior region of said layer while allowing building material to flow into said void locations, wherein said at least one interior region is characterized by a distance from a closest exterior surface of the object which is above a predetermined threshold distance. 15. The system of claim 14 , wherein said predetermined threshold distance equals about 2 millimeters. 16. The system of claim 14 , wherein said predetermined threshold distance is dependent on the spatial direction from the interior region to the exterior surface. 17. The system of claim 14 , further comprising a data processor for selecting said void locations at a bitmap level. 18. The system of claim 17 , wherein said data processor is configured for: preparing a preliminary bitmap according to a predetermined resolution; calculating an expected thickness of the layer resulting from said preliminary bitmap; calculating a ratio between said expected thickness and a predetermined thickness of the layer; and based on said ratio, selecting said void locations in said preliminary bitmap, thereby preparing a bitmap corresponding to said at least one layer. 19. The system of claim 18 , wherein a different dilution transformation is used for different regions in the layers and dilution is not performed in one or more successive layers above defective locations in a layer. 20. The system of claim 1 , wherein said three-dimensional fabrication apparatus is a three-dimensional ink-jet printing apparatus. 21. The system of claim 14 , wherein said three-dimensional fabrication apparatus is a three-dimensional ink-jet printing apparatus.

Assignees

Inventors

Classifications

  • for controlling or regulating additive manufacturing processes · CPC title

  • Processes of additive manufacturing · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • using individual droplets, e.g. from jetting heads · CPC title

  • Modeling, simulating assembly operations · CPC title

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What does patent US9417627B2 cover?
A method of three-dimensional fabrication of an object is disclosed. The method comprises: forming a plurality of layers in a configured pattern corresponding to the shape of the three-dimensional object, at least one layer of the plurality of layers being formed at a predetermined and different thickness selected so as to compensate for post-formation shrinkage of the layer along a vertical di…
Who is the assignee on this patent?
Stratasys Ltd
What technology area does this patent fall under?
Primary CPC classification G05B19/41885. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).