Components of an electronic device and methods for their assembly
US-2024431057-A1 · Dec 26, 2024 · US
US9416461B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9416461-B2 |
| Application number | US-201013500515-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 12, 2010 |
| Priority date | Oct 14, 2009 |
| Publication date | Aug 16, 2016 |
| Grant date | Aug 16, 2016 |
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A mold includes an anodized porous alumina layer over its surface. The anodized porous alumina layer has a plurality of first and second recessed portions. The plurality of second recessed portions have a two-dimensional size of not less than 190 nm and not more than 50 μm when viewed in a direction normal to the mold surface and have a plurality of minute recessed portions over its inner surface. The plurality of minute recessed portions have a two-dimensional size of not less than 10 nm and not more than 200 nm; and have a two-dimensional size of not less than 10 nm and not more than 200 nm. The plurality of first recessed portions are provided between the plurality of second recessed portions. The average value of the two-dimensional size of the plurality of second recessed portions is greater than that of the plurality of first recessed portions.
Opening claim text (preview).
The invention claimed is: 1. A mold, comprising: an anodized porous alumina layer over its surface, the anodized porous alumina layer having a plurality of first recessed portions and a plurality of second recessed portions, wherein the plurality of second recessed portions have a two-dimensional size of not less than 190 nm and not more than 50 μm when viewed in a direction normal to the mold surface, the plurality of second recessed portions having a plurality of minute recessed portions over its inner surface, the plurality of minute recessed portions having a two-dimensional size of not less than 10 nm and not more than 200 nm, and a distribution of the plurality of second recessed portions has no regularity, the plurality of first recessed portions have a two-dimensional size of not less than 10 nm and not more than 200 nm, the plurality of first recessed portions being provided between the plurality of second recessed portions, and an average value of the two-dimensional size of the plurality of second recessed portions is greater than an average value of the two-dimensional size of the plurality of first recessed portions. 2. The mold of claim 1 , wherein an area ratio of the plurality of second recessed portions is not less than 0.7%. 3. The mold of claim 1 , wherein the average value of the two-dimensional size of the plurality of second recessed portions is not less than 2.73 times the average value of the two-dimensional size of the plurality of first recessed portions. 4. The mold of claim 1 , wherein a descending angle of the inner surface of the plurality of second recessed portions relative to the mold surface is not more than 90°. 5. The mold of claim 2 , wherein the two-dimensional size of the plurality of second recessed portions is not less than 400 nm and not more than 50 μm, and the area ratio of the plurality of second recessed portions is not less than 0.8%. 6. An antireflection film manufactured using the mold of claim 5 , wherein the antireflection film has a plurality of first raised portions and a plurality of second raised portions over its surface, the plurality of first raised portions having a base whose two-dimensional size is not less than 100 nm and not more than 200 nm, the plurality of second raised portions having a two-dimensional size of not less than 400 nm and not more than 50 μm, and an ascending angle of the plurality of second raised portions relative to the surface is not more than 90°. 7. A method of fabricating the mold of claim 1 , the method comprising the steps of: (a) providing an aluminum film or an aluminum base whose purity is not less than 99.5 mass %; (b) performing an etching on a surface of the aluminum film or the aluminum base with the surface of the aluminum film or the aluminum base in an etching solution being in contact with a metal whose standard electrode potential is higher than that of the aluminum film or the aluminum base, thereby forming a plurality of recessed portions whose two-dimensional size is not less than 190 nm and not more than 50 μm; and (c) after step (b), anodizing the surface of the aluminum film or the aluminum base to form a porous alumina layer over an inner surface of the plurality of recessed portions and between the plurality of recessed portions, thereby forming the plurality of first recessed portions and the plurality of second recessed portions. 8. The method of claim 7 , further comprising: (d) after step (c), bringing the porous alumina layer into contact with the etching solution, thereby enlarging the plurality of minute recessed portions and the plurality of first recessed portions; and (e) after step (d), further anodizing the surface of the aluminum film or the aluminum base, thereby growing the plurality of minute recessed portions and the plurality of first recessed portions. 9. The method of claim 7 , further comprising: (f) between step (a) and step (b), anodizing the surface of the aluminum film or the aluminum base, thereby forming an anodized layer; and (g) between step (b) and step (c), dissolving away the anodized layer. 10. The mold of claim 1 , wherein the plurality of second recessed portions comprise: a second recessed portion having the two-dimensional size of not less than 190 nm and less than 250 nm, a second recessed portion having the two-dimensional size of not less than 250 nm and less than 300 nm, and a second recessed portion having the two-dimensional size of not less than 300 nm and less than 350 nm. 11. The mold of claim 1 , wherein the plurality of second recessed portions comprise: a second recessed portion having the two-dimensional size of not less than 350 nm and less than 450 nm, a second recessed portion having the two-dimensional size of not less than 450 nm and less than 550 nm, and a second recessed portion having the two-dimensional size of not less than 550 nm and less than 650 nm.
Anodising more than once, e.g. in different baths · CPC title
having particular surface properties, e.g. a micropattern · CPC title
Coatings {, e.g. enameled or galvanised}; Releasing, lubricating or separating agents {(in-mould coating B29C37/0028; using or applying separating agents B29C37/0067)} · CPC title
Production of filters · CPC title
Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372) · CPC title
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